产品概述
描述
The LSM6DSV16X is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with a triple core for processing acceleration and angular rate data on 3 separate channels with dedicated configuration, processing and filtering. The LSM6DSV16X boosts performance at 0.65 mA in high-performance mode and enables always-on low-power features for an optimal motion experience for the consumer.The LSM6DSV16X embeds advanced dedicated features and data filtering for OIS, EIS and motion processing like filtering, finite state machine and MLC with an exportable AI feature for IoT applications.
The LSM6DSV16X embeds Qvar (electric charge variation detection) for user interface functions: tap, double-tap, triple-tap, long press, L/R – R/L swipe.
The LSM6DSV16X embeds an analog hub which is able to connect an external analog input and convert it to a digital signal for processing.
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所有功能
- Triple core for UI, EIS and OIS data processing
- Power consumption: 0.65 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 4.5 kbyte
- Android compliant
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000/±4000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (extended range: 1.08 V to 3.6 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- OIS configurable from aux SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)
- EIS dedicated channel on primary interface with dedicated filtering
- Advanced pedometer, step detector and step counter
- Significant motion detection, tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable finite state machine for accelerometer, gyroscope and external sensor data processing with high rate @ 960 Hz
- Machine learning core with exportable features and filters for AI applications
- Embedded Qvar (electrostatic sensor) for user interface functions (tap, double-tap, triple-tap, long press, L/R – R/L swipe)
- Embedded analog hub for ADC and processing analog input data
- S4S data synchronization
- Embedded temperature sensor
- ECOPACK, RoHS and “Green” compliant
精选 视频
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
All tools & software
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 22 Dec 2021 | 22 Dec 2021 |
应用手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 24 Feb 2022 | 24 Feb 2022 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 31 Aug 2021 | 31 Aug 2021 |
Design Notes & Tips (5)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 24 Jan 2022 | 24 Jan 2022 | ||
| 1.0 | 16 Mar 2022 | 16 Mar 2022 | ||
| 1.0 | 16 Mar 2022 | 16 Mar 2022 | ||
| 1.0 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 |
简报 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Jan 2021 | 13 Jan 2021 |
手册 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 05 Apr 2022 | 05 Apr 2022 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 12.21 | 09 Dec 2021 | 09 Dec 2021 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
EDA符号、封装和3D模型
STMicroelectronics - LSM6DSV16X
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符号
封装
3D模型
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| LSM6DSV16XTR | 无法联系到经销商，请联系我们的销售办事处 | 评估 | EAR99 | NEC | Tape and Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | | ||
无法联系到经销商，请联系我们的销售办事处
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