LSM6DSV16X

评估
Design Win

iNEMO 3D加速度计和3D陀螺仪:常开惯性模块,配嵌入式机器学习核心和Qvar静电传感器

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概述
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
开始
Partner products
Sales Briefcase

产品概述

描述

The LSM6DSV16X is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with a triple core for processing acceleration and angular rate data on 3 separate channels with dedicated configuration, processing and filtering. The LSM6DSV16X boosts performance at 0.65 mA in high-performance mode and enables always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSV16X embeds advanced dedicated features and data filtering for OIS, EIS and motion processing like filtering, finite state machine and MLC with an exportable AI feature for IoT applications.
The LSM6DSV16X embeds Qvar (electric charge variation detection) for user interface functions: tap, double-tap, triple-tap, long press, L/R – R/L swipe.
The LSM6DSV16X embeds an analog hub which is able to connect an external analog input and convert it to a digital signal for processing.
  • 所有功能

    • Triple core for UI, EIS and OIS data processing
    • Power consumption: 0.65 mA in combo high-performance mode
    • “Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 4.5 kbyte
    • Android compliant
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000/±4000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (extended range: 1.08 V to 3.6 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
    • Auxiliary SPI for OIS data output for gyroscope and accelerometer
    • OIS configurable from aux SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)
    • EIS dedicated channel on primary interface with dedicated filtering
    • Advanced pedometer, step detector and step counter
    • Significant motion detection, tilt detection
    • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
    • Programmable finite state machine for accelerometer, gyroscope and external sensor data processing with high rate @ 960 Hz
    • Machine learning core with exportable features and filters for AI applications
    • Embedded Qvar (electrostatic sensor) for user interface functions (tap, double-tap, triple-tap, long press, L/R – R/L swipe)
    • Embedded analog hub for ADC and processing analog input data
    • S4S data synchronization
    • Embedded temperature sensor
    • ECOPACK, RoHS and “Green” compliant

All tools & software

    • 产品型号
      状态
      描述
      类型
      供应商

      IMU383ZA

      批量生产

      High-performance inertial platform

      合作伙伴提供的硬件集成设备 ACEINNA
      IMU383ZA

      描述:

      High-performance inertial platform

      SensiBLE

      批量生产

      即用型BLE模块上系统包含了传感器、低功耗ARM® 32位Cortex®-M4 CPU和纽扣电池。立即行动,加快IoT产品开发速度!

      合作伙伴提供的硬件集成设备 SensiEDGE
      SensiBLE

      描述:

      即用型BLE模块上系统包含了传感器、低功耗ARM® 32位Cortex®-M4 CPU和纽扣电池。立即行动,加快IoT产品开发速度!

      SensiSUB

      批量生产

      将低功耗SUB 1GHZ RF收发器连接到云,具有完全可定制的传感器、ARM® 32位Cortex®-M4 CPU和纽扣电池。

      合作伙伴提供的硬件集成设备 SensiEDGE
      SensiSUB

      描述:

      将低功耗SUB 1GHZ RF收发器连接到云,具有完全可定制的传感器、ARM® 32位Cortex®-M4 CPU和纽扣电池。
    • 产品型号
      状态
      描述
      类型
      供应商

      FAE Engineering Services

      批量生产

      关于SensorTile.box的工程服务,例如塑料外壳、硬件和软件/应用定制和板的制造。

      合作伙伴提供的设计服务 FAE Technology
      FAE Engineering Services

      描述:

      关于SensorTile.box的工程服务,例如塑料外壳、硬件和软件/应用定制和板的制造。

      SensiEDGE customization services

      批量生产

      端到端开发服务:硬件、固件、软件开发、附件、云和移动应用。使用SensiEDGE加快IoT项目的开发速度!

      合作伙伴提供的设计服务 SensiEDGE
      SensiEDGE customization services

      描述:

      端到端开发服务:硬件、固件、软件开发、附件、云和移动应用。使用SensiEDGE加快IoT项目的开发速度!
    • 产品型号
      状态
      描述
      类型
      供应商

      AlgoBuilder

      批量生产

      算法的图形化设计应用

      Sensor Software Development Tools ST
      AlgoBuilder

      描述:

      算法的图形化设计应用

EDA符号、封装和3D模型

STMicroelectronics - LSM6DSV16X

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 符合RoHS级别 材料声明**
LSM6DSV16XTR
评估
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DSV16XTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

评估

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
LSM6DSV16XTR 无法联系到经销商,请联系我们的销售办事处
评估
EAR99 NEC Tape and Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES

LSM6DSV16XTR 评估

封装:
VFLGA2.5X3X.86 14L P.5 L.475X.25
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

LSM6DSV16XTR

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

PHILIPPINES

无法联系到经销商,请联系我们的销售办事处
Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商