产品概述
描述
The LSM9DS1 is a system-in-package featuring a 3D digital linear acceleration sensor, a 3D digital angular rate sensor, and a 3D digital magnetic sensor. The LSM9DS1 has a linear acceleration full scale of ±2g/±4g/±8/±16 g, a magnetic field full scale of ±4/±8/±12/±16 gauss and an angular rate of ±245/±500/±2000 dps.The LSM9DS1 includes an I2C serial bus interface supporting standard and fast mode (100 kHz and 400 kHz) and an SPI serial standard interface.
Magnetic, accelerometer and gyroscope sensing can be enabled or set in power-down mode separately for smart power management.
The LSM9DS1 is available in a plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
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所有功能
- 3 acceleration channels, 3 angular rate channels, 3 magnetic field channels
- ±2/±4/±8/±16 g linear acceleration full scale
- ±4/±8/±12/±16 gauss magnetic full scale
- ±245/±500/±2000 dps angular rate full scale
- 16-bit data output
- SPI / I2C serial interfaces
- Analog supply voltage 1.9 V to 3.6 V
- “Always-on” eco power mode down to 1.9 mA
- Programmable interrupt generators
- Embedded temperature sensor
- Embedded FIFO
- Position and motion detection functions
- Click/double-click recognition
- Intelligent power saving for handheld devices
- ECOPACK®, RoHS and “Green” compliant
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All tools & software
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 3.0 | 23 Mar 2015 | 23 Mar 2015 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 29 Jun 2021 | 29 Jun 2021 |
Design Notes & Tips (5)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.0 | 08 Jan 2021 | 08 Jan 2021 | ||
| 1.0 | 11 Jan 2021 | 11 Jan 2021 | ||
| 1.0 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 |
简报 (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 15 Jun 2021 | 15 Jun 2021 | ||
| 1.0 | 13 Jan 2021 | 13 Jan 2021 |
宣传册 (3)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 11 Mar 2020 | 11 Mar 2020 | ||
| 2.0 | 01 Jul 2020 | 01 Jul 2020 | ||
| 1.0 | 11 Mar 2020 | 11 Mar 2020 |
手册 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 07 Apr 2021 | 07 Apr 2021 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 2.0 | 25 Feb 2021 | 25 Feb 2021 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
EDA符号、封装和3D模型
STMicroelectronics - LSM9DS1
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| LSM9DS1TR | 1 distributors | 批量生产 | EAR99 | NEC | Tape And Reel | TFLGA 3.5X3X1 24L | -40 | 85 | MALTA | 4.8435 / 1k | ||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
4.8435 / 1k