MEMS麦克风是为需要小尺寸、高音质、高可靠性和高经济效益的音频应用而设计。
意法半导体的MEMS麦克风由意法半导体自行设计、开发、制造,创造了业界独一无二的垂直集成供应链。提供模拟和数字输出,及顶开孔和底开孔解决方案。
我们最佳的声学过载点(AOP)和信噪比(SNR)令意法半导体的MEMS麦克风适合于在任何环境中都需要超高的动态范围、增强的音频体验的应用。超高精度的灵敏度匹配能够针对多麦克风阵列优化波束成形和噪声消除算法。低功耗产品能够延长电池寿命。
意法半导体MEMS麦克风适用于您能想到的所有应用领域:移动终端、便携式电脑和笔记本电脑、便携式媒体播放器、VoIP、语音识别、音/视频电子学习设备、游戏和虚拟现实输入设备。
意法半导体MEMS麦克风提供金属和塑料封装,由于尺寸极小,可以用在任何可能的环境中。
提供的各种开发工具(包括麦克风附连板和示例代码)可帮助开发人员缩短设计时间。
意法半导体提供了软件和声学垫片仿真支持,确保了您音频应用所需的快速开发的最佳解决方案。
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特别推荐
Breakthrough digital bottom port microphone with multiple performance modes
Thanks to high performance and low current consumption, the MP23DB01HP MEMS microphone is the perfect choice for high-end personal electronics, computer, and automotive applications.
The multi-mode digital bottom-port microphone combines a best-in-class acoustic overload point (AOP) for handling input signals without distortion, very high signal-to-noise ratio (SNR) for far-field applications and accurate sensitivity matching.
Benefits include:
- Saves energy with multi-mode operation
- Enables voice command recognition
- Ultra-low distortion
- Flat frequency response
- PDM output and sensitivity matching
- Hardware and software evaluation tools and developer resources
Visit the MP23DB01HP page to find out more and get started.
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