产品概述
描述
The MP23ABS1 is a compact, low-power microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.
The MP23ABS1 has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio.
The sensitivity of the MP23ABS1 is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.
The MP23ABS1 is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
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所有功能
- Single supply voltage operation 1.52 V - 3.6 V
- Omnidirectional sensitivity
- High signal-to-noise ratio
- High acoustic overload point: 130 dBSPL typ.
- Package compliant with reflow soldering
- Enhanced RF immunity
- Ultra-flat frequency response
- Low latency
- Ultra-low-power: 150 μA max
- ECOPACK, RoHS, and “Green” compliant
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EDA符号、封装和3D模型
STMicroelectronics - MP23ABS1
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| MP23ABS1TR | 批量生产 | RHLGA 2.65X3.5X1.08(MAX)MM 4L | Ecopack1 | |
MP23ABS1TR
Package:
RHLGA 2.65X3.5X1.08(MAX)MM 4LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| MP23ABS1TR | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | RHLGA 2.65X3.5X1.08(MAX)MM 4L | -40 | 85 | CHINA | | ||