STM32H747XG

批量生产
Design Win Education

带DSP和DP-FPU的高性能ARM Cortex-M7 + Cortex-M4 MCU,具有1 MB Flash、1 MB RAM、480 MHz CPU、ART加速器、一级缓存、外部存储器接口、大量外设、SMPS和MIPI-DSI

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产品概述

描述

STM32H747xI/G devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision (Cortex®-M7 core) operations and conversions (IEEE 754 compliant), including a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H747xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory of up to 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.

All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • 所有功能

    • Dual core
      • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
      • 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator™) for internal Flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
    • Memories
      • Up to 2 Mbytes of Flash memory with read-while-write support
      • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface running up to 133 MHz
      • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 125 MHz in Synchronous mode
      • CRC calculation unit
    • 安保
      • ROP, PC-ROP, active tamper
    • General-purpose input/outputs
      • Up to 168 I/O ports with interrupt capability
    • Reset and power management
      • 3 separate power domains which can be independently clock-gated or switched off:
        • D1: high-performance capabilities
        • D2: communication peripherals and timers
        • D3: reset/clock control/power management
      • 1.62 to 3.6 V application supply and I/Os
      • POR, PDR, PVD and BOR
      • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
      • Embedded regulator (LDO) to supply the digital circuitry
      • High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
      • Voltage scaling in Run and Stop mode (6 configurable ranges)
      • Backup regulator (~0.9 V)
      • Voltage reference for analog peripheral/VREF+
      • 1.2 to 3.6 V VBAT supply
      • Low-power modes: Sleep, Stop, Standby and VBAT supporting battery charging
    • Low-power consumption
      • VBAT battery operating mode with charging capability
      • CPU and domain power state monitoring pins
      • 2.95 μA in Standby mode (Backup SRAM OFF, RTC/LSE ON)
    • Clock management
      • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI
      • External oscillators: 4-48 MHz HSE, 32.768 kHz LSE
      • 3× PLLs (1 for the system clock, 2 for kernel clocks) with Fractional mode
    • Interconnect matrix
    • 4 DMA controllers to unload the CPU
      • 1× high-speed master direct memory access controller (MDMA) with linked list support
      • 2× dual-port DMAs with FIFO
      • 1× basic DMA with request router capabilities
    • Up to 35 communication peripherals
      • 4× I2Cs FM+ interfaces (SMBus/PMBus)
      • 4× USARTs/4x UARTs (ISO7816 interface, LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART
      • 6× SPIs, 3 with muxed duplex I2S audio class accuracy via internal audio PLL or external clock, 1x I2S in LP domain (up to 150 MHz)
      • 4x SAIs (serial audio interface)
      • SPDIFRX interface
      • SWPMI single-wire protocol master I/F
      • MDIO Slave interface
      • 2× SD/SDIO/MMC interfaces (up to 125 MHz)
      • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
      • 2× USB OTG interfaces (1FS, 1HS/FS) crystal-less solution with LPM and BCD
      • Ethernet MAC interface with DMA controller
      • HDMI-CEC
      • 8- to 14-bit camera interface (up to 80 MHz)
    • 11 analog peripherals
      • 3× ADCs with 16-bit max. resolution (up to 36 channels, up to 3.6 MSPS)
      • 1× temperature sensor
      • 2× 12-bit D/A converters (1 MHz)
      • 2× ultra-low-power comparators
      • 2× operational amplifiers (7.3 MHz bandwidth)
      • 1× digital filters for sigma delta modulator (DFSDM) with 8 channels/4 filters
    • Graphics
      • LCD-TFT controller up to XGA resolution
      • MIPI DSI host including an MIPI D-PHY to interface with low-pin count large displays
      • Chrom-ART graphical hardware Accelerator™ (DMA2D) to reduce CPU load
      • Hardware JPEG Codec
    • Up to 22 timers and watchdogs
      • 1× high-resolution timer (2.1 ns max resolution)
      • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 240 MHz)
      • 2× 16-bit advanced motor control timers (up to 240 MHz)
      • 10× 16-bit general-purpose timers (up to 240 MHz)
      • 5× 16-bit low-power timers (up to 240 MHz)
      • 4× watchdogs (independent and window)
      • 2× SysTick timers
      • RTC with sub-second accuracy and hardware calendar
    • Debug mode
      • SWD & JTAG interfaces
      • 4-Kbyte Embedded Trace Buffer
    • True random number generators (3 oscillators each)
    • 96-bit unique ID

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EDA符号、封装和3D模型

STMicroelectronics - STM32H747XG

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符号

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封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STM32H747XGH6
批量生产
TFBGA 240+25 14x14x1.2 P 0.8 mm 工业 Ecopack2

STM32H747XGH6

Package:

TFBGA 240+25 14x14x1.2 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

TFBGA 240+25 14x14x1.2 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Budgetary Price (US$)*/Qty
Country of Origin
Timers (typ) (16-bit)
Timers (typ) (32-bit)
Number of Channels (typ)
Number of Channels (typ)
Number of Channels (typ)
D/A Converters (typ) (12-bit)
Comparator
I/Os (High Current)
CAN
CAN FD (typ)
SPI (typ)
I2S (typ)
USART (typ)
UART (typ)
Integrated op-amps
SMPS
最小值
最大值
STM32H747XGH6 Available at distributors

经销商的可用性 STM32H747XGH6

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
批量生产
3A991.a.2 NEC Tray TFBGA 240+25 14x14x1.2 P 0.8 mm -40 85

PHILIPPINES

12

2

-

-

36

2

2

168

-

2

6

3

4

4

2

-

STM32H747XGH6 批量生产

封装:
TFBGA 240+25 14x14x1.2 P 0.8 mm
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

产品型号:

STM32H747XGH6

ECCN (EU):

NEC

包装类型:

Tray

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

PHILIPPINES

Timers (typ) (16-bit):

12

Timers (typ) (32-bit):

2

Number of Channels (typ):

-

Number of Channels (typ):

-

Number of Channels (typ):

36

D/A Converters (typ) (12-bit):

2

Comparator:

2

I/Os (High Current):

168

CAN:

-

CAN FD (typ):

2

SPI (typ):

6

I2S (typ):

3

USART (typ):

4

UART (typ):

4

Integrated op-amps:

2

SMPS:

-

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商