STM32L151C6-A

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超低功耗Arm Cortex-M3 MCU,具有32-KB Flash存储器、32 MHz CPU和USB

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产品概述

描述

The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices incorporate the connectivity power of the universal serial bus (USB) with the high-performance ARM® Cortex®-M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes and RAM up to 32 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All the devices offer a 12-bit ADC, 2 DACs and 2 ultra-low-power comparators, six general-purpose 16-bit timers and two basic timers, which can be used as time bases.
Moreover, the STM32L151x6/8/B-A and STM32L152x6/8/B-A devices contain standard and advanced communication interfaces: up to two I2Cs and SPIs, three USARTs and a USB. The STM32L151x6/8/B-A and STM32L152x6/8/B-A devices offer up to 20 capacitive sensing channels to simply add touch sensing functionality to any application.
They also include a real-time clock with sub-second counting and a set of backup registers that remain powered in Standby mode.
Finally, the integrated LCD controller (except STM32L151x6/8/B-A devices) has a built-in LCD voltage generator that allows to drive up to 8 multiplexed LCDs with contrast independent of the supply voltage.
The ultra-low-power STM32L151x6/8/B-A and STM32L152x6/8/B-A devices operate from a 1.8 to 3.6 V power supply (down to 1.65 V at power down) with BOR and from a 1.65 to 3.6 V power supply without BOR option. They are available in the -40 to +85 °C and -40 to +105°C temperature ranges. A comprehensive set of power-saving modes allows the design of low-power applications.
  • 所有功能

    • Ultra-low-power platform
      • 1.65 V to 3.6 V power supply
      • -40 °C to 105 °C temperature range
      • -40°C to 105°C temperature range
      • 0.28 µA Standby mode (3 wakeup pins)
      • 1.11 µA Standby mode + RTC
      • 0.44 µA Stop mode (16 wakeup lines)
      • 1.38 µA Stop mode + RTC
      • 10.9 µA Low-power Run mode
      • 185 µA/MHz Run mode
      • 10 nA ultra-low I/O leakage
      • 8 µs wakeup time
    • Core: ARM® Cortex®-M3 32-bit CPU
      • From 32 kHz up to 32 MHz max
      • 1.25 DMIPS/MHz (Dhrystone 2.1)
      • Memory protection unit
    • Reset and supply management
      • Ultra-safe, low-power BOR (brownout reset) with 5 selectable thresholds
      • Ultra-low-power POR/PDR
      • Programmable voltage detector (PVD)
    • Clock sources
      • 1 to 24 MHz crystal oscillator
      • 32 kHz oscillator for RTC with calibration
      • High Speed Internal 16 MHz factory-trimmed RC (+/- 1%)
      • Internal low-power 37 kHz RC
      • Internal multispeed low-power 65 kHz to 4.2 MHz
      • PLL for CPU clock and USB (48 MHz)
    • Pre-programmed bootloader
      • USART supported
    • Development support
      • Serial wire debug supported
      • JTAG and trace supported
    • Up to 83 fast I/Os (73 I/Os 5V tolerant), all mappable on 16 external interrupt vectors
    • Memories
      • Up to 128 Kbytes Flash memory with ECC
      • Up to 32 Kbytes RAM
      • Up to 4 Kbytes of true EEPROM with ECC
      • 80-byte backup register
    • LCD Driver (except STM32L151x6/8/B-A devices) for up to 8x40 segments
      • Support contrast adjustment
      • Support blinking mode
      • Step-up converter on board
    • Rich analog peripherals (down to 1.8 V)
      • 12-bit ADC 1 Msps up to 24 channels
      • 12-bit DAC 2 channels with output buffers
      • 2x ultra-low-power-comparators(window mode and wake up capability)
    • DMA controller 7x channels
    • 8x peripheral communication interfaces
      • 1x USB 2.0 (internal 48 MHz PLL)
      • 3x USART (ISO 7816, IrDA)
      • 2x SPI 16 Mbits/s
      • 2x I2C (SMBus/PMBus)
    • 10x timers: 6x 16-bit with up to 4 IC/OC/PWM channels, 2x 16-bit basic timers, 2x watchdog timers (independent and window)
    • Up to 20 capacitive sensing channels supporting touchkey, linear and rotary touch sensors
    • CRC calculation unit, 96-bit unique ID

电路原理图

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      Global Smart Connectivity Services

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      Global Smart Connectivity Services

      描述:

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Octave Services

      批量生产

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud

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      Octave Services

      描述:

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud
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      Enhanced Carrier Connectivity SIM

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      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

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      描述:

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      Global Smart Connectivity SIM

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      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      组件和模块 Sierra Wireless
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      描述:

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      Octave Cellular Modules

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      描述:

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      RF Modules

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      Sub GigaHz和蓝牙的RF模块。

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      SIGFOX-MOD1-C / -E

      描述:

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