产品概述
主要优势
Dual Ethernet Ports
Addressing new applications and markets
Fastest MPU
1GHz MPU for cost-controlled applications
Improved security with certifications
Target highly secured applications like POS, cash registers…
描述
The STM32MP133C/F devices are based on the high-performance Arm® Cortex®-A7 32-bit RISC core operating at up to 1 GHz. The Cortex®-A7 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache and a 128-Kbyte level2 cache. The Cortex®-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20 % more single thread performance than the Cortex®-A5 and provides similar performance to the Cortex®A9.
The Cortex®-A7 incorporates all features of the high-performance Cortex®-A15 and Cortex®-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
The STM32MP133C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP133C/F devices incorporate high-speed embedded memories with 168 Kbytes of internal SRAM (including 128 Kbytes of AXI SYSRAM, two banks of 8 Kbytes and one bank of 16 Kbytes securable AHB SRAM, and 8 Kbytes of SRAM in Backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, and a 64-bit multi-layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, a low-power secured RTC, ten general-purpose 16-bit timers, two 32-bit timers, two PWM timers for motor control, five low-power timers, a secured true random number generator (RNG), and an advanced secured cryptographic acceleration cell. The devices support two digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
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所有功能
- Includes ST state-of-the-art patented technology
- 内核
- 32-bit Arm® Cortex®-A7
- L1 32-Kbyte I / 32-Kbyte D
- 128-Kbyte unified level 2 cache
- Arm® NEON™ and Arm® TrustZone®
- 32-bit Arm® Cortex®-A7
- Memories
- External DDR memory up to 1 Gbyte
- up to LPDDR2/LPDDR3-1066 16-bit
- up to DDR3/DDR3L-1066 16-bit
- 168 Kbytes of internal SRAM: 128 Kbytes of AXI SYSRAM + 32 Kbytes of AHB SRAM and 8 Kbytes of SRAM in Backup domain
- Dual Quad-SPI memory interface
- Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
- External DDR memory up to 1 Gbyte
- Security/safety
- Secure boot, TrustZone® peripherals, 12 x tamper pins including 5 x active tampers
- Temperature, voltage, frequency and 32 kHz monitoring
- Reset and power management
- 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
- POR, PDR, PVD and BOR
- On-chip LDOs (USB 1.8 V, 1.1 V)
- Backup regulator (~0.9 V)
- Internal temperature sensors
- Low-power modes: Sleep, Stop, LPLV-Stop, LPLVStop2 and Standby
- DDR retention in Standby mode
- Controls for PMIC companion chip
- Clock management
- Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
- External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
- 4 × PLLs with fractional mode
- General-purpose input/outputs
- Up to 135 secure I/O ports with interrupt capability
- Up to 6 wakeup
- Interconnect matrix
- 2 bus matrices
- 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
- 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
- 2 bus matrices
- 4 DMA controllers to unload the CPU
- 56 physical channels in total
- 1 x high-speed general-purpose master direct memory access controller (MDMA)
- 3 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
- Up to 29 communication peripherals
- 5 × I2C FM+ (1 Mbit/s, SMBus/PMBus™)
- 4 x UART + 4 x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
- 5 × SPI (50 Mbit/s, including 4 with full-duplex I2S audio class accuracy via internal audio PLL or external clock)
- 2 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
- SPDIF Rx with 4 inputs
- 2 × SDMMC up to 8 bits (SD/e•MMC™/SDIO)
- 2 × CAN controllers supporting CAN FD protocol
- 2 × USB 2.0 high-speed Host
- or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
- 2 x Ethernet MAC/GMAC
- IEEE 1588v2 hardware, MII/RMII/RGMII
- 6 analog peripherals
- 2 × ADCs with 12-bit max. resolution up to 5 Msps
- 1 x temperature sensor
- 1 x digital filter for sigma-delta modulator (DFSDM) with 4 channels and 2 filters
- Internal or external ADC reference VREF+
- Up to 24 timers and 2 watchdogs
- 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
- 2 × 16-bit advanced timers
- 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
- 5 × 16-bit low-power timers
- Secure RTC with sub-second accuracy and hardware calendar
- 4 Cortex®-A7 system timers (secure, nonsecure, virtual, hypervisor)
- 2 × independent watchdogs
- Hardware acceleration
- AES 128, 192, 256 DES/TDES
- AES 128, 256 with DPA protection
- PKA ECC/RSA with DPA protection
- AES 128 on-the-fly DRAM encryption and decryption
- HASH (SHA-1, SHA-224, SHA-256, SHA-384, SHA-512, SHA-3), HMAC
- 1 x true random number generator (6 triple oscillators)
- 1 x CRC calculation unit
- Debug mode
- Arm® CoreSight™ trace and debug: SWD and JTAG interfaces usable as GPIOs
- 4-Kbyte embedded trace buffer
- 3072-bit fuses including 96-bit unique ID, up to 1280 bits available for user and 256-bit HUK to protect AES 256 keys
- All packages are ECOPACK2 compliant
电路原理图
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STMicroelectronics - STM32MP133F
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符号
封装
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全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
HW Models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 08 Mar 2023 | 08 Mar 2023 |
IBIS models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 06 Mar 2023 | 06 Mar 2023 |
BSDL files (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 4.0 | 07 Jun 2023 | 07 Jun 2023 |
Board Manufacturing Specifications (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 7Z | 1.0 | 08 Mar 2023 | 08 Mar 2023 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| STM32MP133FAE7 | 批量生产 | LFBGA 14X14 289L PITCH 0.8 MM | 工业 | Ecopack2 | |
| STM32MP133FAF7 | 批量生产 | TFBGA 11X11 320L PITCH 0.5 MM | 工业 | Ecopack2 | |
| STM32MP133FAG7 | 批量生产 | TFBGA 9X9 289L PITCH 0.5 MM | 工业 | Ecopack2 | |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Junction Temperature (°C) (min) | Junction Temperature (°C) (max) | Country of Origin | Budgetary Price (US$)*/Qty | Junction Temperature (°C) (max) | 单价(US$) | Country of Origin | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||||
| STM32MP133FAE7 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 5A992.c | NEC | Tray | LFBGA 14X14 289L PITCH 0.8 MM | - | - | -40 | 105 | TAIWAN | | 105 | 5.2297 | TAIWAN | ||
| STM32MP133FAG7 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 5A992.c | NEC | Tray | TFBGA 9X9 289L PITCH 0.5 MM | - | - | -40 | 105 | TAIWAN | | 105 | 4.4434 | TAIWAN | ||
| STM32MP133FAF7 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 5A992.c | NEC | Tray | TFBGA 11X11 320L PITCH 0.5 MM | - | - | -40 | 105 | TAIWAN | | 105 | 4.6629 | TAIWAN | ||
STM32MP133FAE7 批量生产
STM32MP133FAG7 批量生产
STM32MP133FAF7 批量生产