MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, TFT display, FD-CAN, Secure boot and Cryptography

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  • The STM32MP153C devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 650 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

    The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
    The STM32MP153C devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
    The STM32MP153C devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
    The STM32MP153C devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
    All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

    主要特性

    • Core
      • 32-bit dual-core Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D for each core
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 KB of AXI SYSRAM + 384 KB of AHB SRAM + 64 KB of AHB SRAM in backup domain and 4 KB of SRAM in backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • LPDDR2/3 retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 6 μA
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 5 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 Tamper, 1 Active-Tamper
    • Interconnect matrix
    • 3 DMA controllers to unload the CPU
    • Up to 37 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™ / SDIO)
      • 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits 5 Msps, 14 bits 4.4 Msps, 16 bits 250 ksps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps
        • Two layers with programmable colour LUT
    • Up to 29 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • AES 128, 192, 256, TDES
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user

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STM32MP153CAC3 TFBGA361 Tray
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STM32MP153CAB3 LFBGA354 Tray
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STM32MP153CAC3T

Package

TFBGA361

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Tape And Reel

Unit Price (US$)

8.4*

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Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.4

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAA3T

Package

LFBGA448

Packing Type

Tape And Reel

Unit Price (US$)

10.0*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

10

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAD3T

Package

TFBGA257

Packing Type

Tape And Reel

Unit Price (US$)

8.1*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.1

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAD3

Package

TFBGA257

Packing Type

Tray

Unit Price (US$)

8.1*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.1

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAA3

Package

LFBGA448

Packing Type

Tray

Unit Price (US$)

10.0*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

10

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAB3T

Package

LFBGA354

Packing Type

Tape And Reel

Unit Price (US$)

9.2*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

9.2

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAC3

Package

TFBGA361

Packing Type

Tray

Unit Price (US$)

8.4*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.4

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP153CAB3

Package

LFBGA354

Packing Type

Tray

Unit Price (US$)

9.2*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

9.2

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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型号 Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32MP153CAA3
Active
LFBGA448 工业 Ecopack2
STM32MP153CAA3T
Active
LFBGA448 工业 Ecopack2
STM32MP153CAB3
Active
LFBGA354 工业 Ecopack2
STM32MP153CAB3T
Active
LFBGA354 工业 Ecopack2
STM32MP153CAC3
Active
TFBGA361 工业 Ecopack2
STM32MP153CAC3T
Active
TFBGA361 工业 Ecopack2
STM32MP153CAD3
Active
TFBGA257 工业 Ecopack2
STM32MP153CAD3T
Active
TFBGA257 工业 Ecopack2

STM32MP153CAA3

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAA3T

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAB3

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAB3T

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAC3

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAC3T

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAD3

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153CAD3T

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.