MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN

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  • 主要特性

    • Core
      • 32-bit dual-core Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D for each core
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • LPDDR2/3 retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 6 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 tampers, 1 active tamper
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 1 × high-speed general-purpose master direct memory access controller (MDMA)
      • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 37 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™ / SDIO)
      • 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • 3D GPU: Vivante® - OpenGL® ES 2.0
        • Up to 26 Mtriangle/s, 133 Mpixel/s
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps
        • Two layers with programmable colour LUT
      • MIPI® DSI 2 data lanes up to 1 GHz each
    • Up to 29 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
    • All packages are ECOPACK2 compliant

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STM32MP157AAC3T

封装

TFBGA361

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Unit Price (US$)

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10000

ECCN (US)

3A991A2

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STM32MP157AAB3

封装

LFBGA354

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Unit Price (US$)

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数量

10000

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3A991A2

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STM32MP157AAB3T

封装

LFBGA354

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Unit Price (US$)

10.0*

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Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

10

数量

10000

ECCN (US)

3A991A2

Country of Origin

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STM32MP157AAA3

封装

LFBGA448

包装类型

Tray

Unit Price (US$)

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代理商库存报告日期: 2019-08-22

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Junction Temperature (°C) (min)

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Junction Temperature (°C) (max)

125

Unit Price (US$)

10.8

数量

10000

ECCN (US)

3A991A2

Country of Origin

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STM32MP157AAD3T

封装

TFBGA257

包装类型

Tape And Reel

Unit Price (US$)

8.9*

供货状态

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.9

数量

10000

ECCN (US)

3A991A2

Country of Origin

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STM32MP157AAD3

封装

TFBGA257

包装类型

Tray

Unit Price (US$)

8.9*

Distributor availability ofSTM32MP157AAD3

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DIGIKEY WORLDWIDE 40 1 Order Now
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库存

45

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Farnell Element14

库存

146

Min.Order

1

地区

EUROPE Order Now

代理商库存报告日期: 2019-08-22

供货状态

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

8.9

数量

10000

ECCN (US)

3A991A2

Country of Origin

-

STM32MP157AAA3T

封装

LFBGA448

包装类型

Tape And Reel

Unit Price (US$)

10.8*

供货状态

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

10.8

数量

10000

ECCN (US)

3A991A2

Country of Origin

-

STM32MP157AAC3

封装

TFBGA361

包装类型

Tray

Unit Price (US$)

9.2*

Distributor availability ofSTM32MP157AAC3

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地区 库存 最小订购量 Third party link
DIGIKEY WORLDWIDE 50 1 Order Now
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FUTURE WORLDWIDE 50 1 Order Now
ARROW EUROPE 3313 0 Order Now
Newark Element14 AMERICA 25 0 Order Now
MOUSER WORLDWIDE 50 1 Order Now
Farnell Element14 EUROPE 130 1 Order Now

代理商库存报告日期: 2019-08-22

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库存

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WORLDWIDE Order Now

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3313

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0

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库存

50

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1

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WORLDWIDE Order Now

Farnell Element14

库存

130

Min.Order

1

地区

EUROPE Order Now

代理商库存报告日期: 2019-08-22

供货状态

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

9.2

数量

10000

ECCN (US)

3A991A2

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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技术文档

    • 描述 版本 文档大小 操作
      DS12504
      Arm® dual Cortex®-A7 650 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog
      2.0
      3.32 MB
      PDF
      DS12504

      Arm® dual Cortex®-A7 650 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog

    • 描述 版本 文档大小 操作
      AN5168
      DDR configuration on STM32MP1 Series MPUs
      1.0
      374.96 KB
      PDF
      AN5031
      Getting started with STM32MP1 Series hardware development
      1.0
      1.86 MB
      PDF
      AN5027
      使用STM32 32位Arm® Cortex®MCU连接PDM数字麦克风
      1.0
      2.15 MB
      PDF
      AN5253
      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines
      1.0
      206.89 KB
      PDF
      AN5122
      STM32MP1 Series DDR memory routing guidelines
      3.0
      734.71 KB
      PDF
      AN5284
      STM32MP1 Series system power consumption
      1.0
      223.69 KB
      PDF
      AN5109
      STM32MP1 Series using low-power modes
      3.0
      1.11 MB
      PDF
      AN5256
      STM32MP151, STM32MP153 and STM32MP157 discrete power supply hardware integration
      1.0
      700.33 KB
      PDF
      AN5036
      Thermal management guidelines for STM32 applications
      3.0
      4.84 MB
      PDF
      AN5225
      USB Type-C™ Power Delivery using STM32xx Series MCUs and STM32xxx Series MPUs
      1.0
      1.42 MB
      PDF
      AN5168

      DDR configuration on STM32MP1 Series MPUs

      AN5031

      Getting started with STM32MP1 Series hardware development

      AN5027

      使用STM32 32位Arm® Cortex®MCU连接PDM数字麦克风

      AN5253

      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines

      AN5122

      STM32MP1 Series DDR memory routing guidelines

      AN5284

      STM32MP1 Series system power consumption

      AN5109

      STM32MP1 Series using low-power modes

      AN5256

      STM32MP151, STM32MP153 and STM32MP157 discrete power supply hardware integration

      AN5036

      Thermal management guidelines for STM32 applications

      AN5225

      USB Type-C™ Power Delivery using STM32xx Series MCUs and STM32xxx Series MPUs

    • 描述 版本 文档大小 操作
      RM0436
      STM32MP157 advanced Arm®-based 32-bit MPUs
      3.0
      80.71 MB
      PDF
      RM0436

      STM32MP157 advanced Arm®-based 32-bit MPUs

    • 描述 版本 文档大小 操作
      PM0214
      STM32 Cortex®-M4 MCUs and MPUs programming manual
      8.0
      2.94 MB
      PDF
      PM0214

      STM32 Cortex®-M4 MCUs and MPUs programming manual

    • 描述 版本 文档大小 操作
      ES0438
      STM32MP151x/3x/7x device errata
      1.0
      341.5 KB
      PDF
      ES0438

      STM32MP151x/3x/7x device errata

硬件型号、CAD库及SVD

    • 描述 版本 文档大小 操作
      STM32MP1 CAD Symbol and Footprint files 1.3
      1.82 MB
      ZIP
      STM32MP1 Lauterbach Trace Script 1.0
      105.69 KB
      ZIP
      STM32MP1 System View Description 1.0
      247.84 KB
      ZIP

      STM32MP1 CAD Symbol and Footprint files

      STM32MP1 Lauterbach Trace Script

      STM32MP1 System View Description

    • 描述 版本 文档大小 操作
      STM32MP1 BSDL file 1.0
      80.24 KB
      ZIP
      STM32MP1 IBIS file 1.0
      31.99 MB
      ZIP

      STM32MP1 BSDL file

      STM32MP1 IBIS file

演示和培训资料

    • 描述 版本 文档大小 操作
      STM32MP1 Microprocessor - Continuing the STM32 Success Story 1.1
      2.3 MB
      PDF

      STM32MP1 Microprocessor - Continuing the STM32 Success Story

硬件资源

    • 描述 版本 文档大小 操作
      STM32MP1 Series DDR memory routing guidelines examples 2.0
      21.34 MB
      ZIP

      STM32MP1 Series DDR memory routing guidelines examples

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      STM32MP1 Series Microprocessors 19.02
      455.68 KB
      PDF

      STM32MP1 Series Microprocessors

产品型号 供货状态 封装 等级规格 符合RoHS级别 材料声明**
STM32MP157AAA3
Active
LFBGA448 工业 Ecopack2
STM32MP157AAA3T
Active
LFBGA448 工业 Ecopack2
STM32MP157AAB3
Active
LFBGA354 工业 Ecopack2
STM32MP157AAB3T
Active
LFBGA354 工业 Ecopack2
STM32MP157AAC3
Active
TFBGA361 工业 Ecopack2
STM32MP157AAC3T
Active
TFBGA361 工业 Ecopack2
STM32MP157AAD3
Active
TFBGA257 工业 Ecopack2
STM32MP157AAD3T
Active
TFBGA257 工业 Ecopack2

STM32MP157AAA3

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157AAA3T

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157AAB3

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157AAB3T

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157AAC3

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157AAC3T

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157AAD3

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157AAD3T

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.