产品概述
描述
The STM32WB15CC multiprotocol wireless and ultra-low-power device embeds a powerful and ultra-low-power radio compliant with the Bluetooth® Low Energy SIG specification v5.2. It contains a dedicated Arm® Cortex® -M0+ for performing all the real-time low layer operation.
The device is designed to be extremely low-power and is based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 64 MHz. This core features a Floating point unit (FPU) single precision that supports all Arm®single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.
Enhanced inter-processor communication is provided by the IPCC with six bidirectional channels. The HSEM provides hardware semaphores used to share common resources between the two processors.
The device embeds high-speed memories (320 Kbyte of Flash memory, 48 Kbytes of SRAM) and an extensive range of enhanced I/Os and peripherals.
Direct data transfer between memory and peripherals and from memory to memory is supported by seven DMA channels with a full flexible channel mapping by the DMAMUX peripheral.
The device feature several mechanisms for embedded Flash memory and SRAM: readout protection, write protection and proprietary code readout protection. Portions of the memory can be secured for Cortex® -M0+ exclusive access.
The AES encryption engine, PKA and RNG enable upper layer cryptography.
The device offers a fast 12-bit ADC and one ultra-low-power comparator.
The device embeds a low-power RTC, one advanced 16-bit timer, one general-purpose32-bit timer, and two 16-bit low-power timers.
In addition, up to eight capacitive sensing channels are available.
The STM32WB15CC also features standard and advanced communication interfaces, namely one USART (ISO 7816, IrDA, Modbus and Smartcard mode), one low- power UART (LPUART), one I2C (SMBus/PMBus), one SPI up to 32 MHz.
The STM32WB15CC operates in the -40 to +85 °C (+105 °C junction) and -40 to +105 °C (+125 °C junction) temperature ranges from a 1.71 to 3.6 V power supply. A comprehensive set of power-saving modes enables the design of low-power applications.
The STM32WB15CC integrates a high efficiency SMPS step-down converter with automatic bypass mode capability when the VDD falls below VBORx (x=1, 2, 3, 4) voltage level (default is 2.0 V). It includes independent power supplies for analog input for ADC and comparator.
A VBAT dedicated supply allows the device to back up the LSE 32.768 kHz oscillator, the RTC and the backup registers, thus enabling the STM32WB15CC to supply these functions even if the main VDD is not present through a CR2032-like battery, a Supercap or a small rechargeable battery.
The STM32WB15CC offers one package, 48 pins.
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所有功能
- Includes ST state-of-the-art patented technology
- Radio
- 2.4 GHz
- RF transceiver supporting Bluetooth® 5.2 specification
- RX sensitivity: -95.5 dBm (Bluetooth® Low Energy at 1 Mbps)
- Programmable output power up to +5.5 dBm with 1 dB steps
- Integrated balun to reduce BOM
- Support for 2 Mbps
- Dedicated Arm® 32-bit Cortex® M0+ CPU for real-time Radio layer
- Accurate RSSI to enable power control
- Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
- Support for external PA
- Available integrated passive device (IPD) companion chip for optimized matching solution (MLPF-WB-01E3)
- Ultra-low-power platform
- 1.71 to 3.6 V power supply
- – 40 °C to 85 / 105 °C temperature ranges
- 12 nA shutdown mode
- 610 nA Standby mode + RTC + 48 KB RAM
- Active-mode MCU: 33 µA / MHz when RF and SMPS on
- Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA
- Core: Arm® 32-bit Cortex®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator) allowing 0-wait-state execution from Flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
- Performance benchmark
- 1.25 DMIPS/MHz (Drystone 2.1)
- Supply and reset management
- High efficiency embedded SMPS step-down converter with intelligent bypass mode
- Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
- Ultra-low-power POR/PDR
- Programmable voltage detector (PVD)
- VBAT mode with RTC and backup registers
- Clock sources
- 32 MHz crystal oscillator with integrated trimming capacitors (Radio and CPU clock)
- 32 kHz crystal oscillator for RTC (LSE)
- Internal low-power 32 kHz RC (LSI1)
- Internal low-drift 32 kHz RC (LSI2)
- Internal multispeed 100 kHz to 48 MHz oscillator, factory-trimmed
- High speed internal 16 MHz factory trimmed RC
- 1x PLL for system clock and ADC
- Memories
- 320 KB Flash memory with sector protection (PCROP) against R/W operations, enabling radio stack and application
- 48 KB SRAM, including 36 KB with hardware parity check
- 20x32-bit backup register
- Boot loader supporting USART, SPI, I2C interfaces
- 1 Kbyte (128 double words) OTP
- Rich analog peripherals (down to 1.62 V)
- 12-bit ADC 2.5 Msps, 190 µA/Msps
- 1x ultra-low-power comparator
- System peripherals
- Inter processor communication controller (IPCC) for communication with Bluetooth® Low Energy
- HW semaphores for resources sharing between CPUs
- 1x DMA controller (7x channels) supporting ADC, SPI, I2C, USART, AES, timers
- 1x USART (ISO 7816, IrDA, SPI Master, Modbus and Smartcard mode)
- 1x LPUART (low power)
- 1x SPI 32 Mbit/s
- 1x I2C (SMBus/PMBus)
- Touch sensing controller, up to eight sensors
- 1x 16-bit, four channels advanced timer
- 1x 32-bit, four channels timer
- 2x 16-bit ultra-low-power timer
- 1x independent Systick
- 1x independent watchdog
- 1x window watchdog
- Security and ID
- Secure firmware installation (SFI) for Bluetooth® Low Energy SW stack
- 2x hardware encryption AES maximum 256-bit for the application and the Bluetooth® Low Energy
- HW public key authority (PKA)
- Cryptographic algorithms: RSA, Diffie-Helman, ECC over GF(p)
- True random number generator (RNG)
- Sector protection against R/W operation (PCROP)
- CRC calculation unit
- Die information: 96-bit unique ID
- IEEE 64-bit unique ID. Possibility to derive Bluetooth® Low Energy 48-bit EUI
- Up to 37 fast I/Os, 35 of them 5 V-tolerant
- Development support
- Serial wire debug (SWD), JTAG for the application processor
- Application cross trigger
- All packages are ECOPACK2 compliant
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EDA符号、封装和3D模型
全部资源
Resource title | 版本 | Latest update |
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System View Description (1)
Resource title | 版本 | Latest update | ||
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ZIP | 1.1 | 10 May 2021 | 10 May 2021 |
IBIS models (1)
Resource title | 版本 | Latest update | ||
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ZIP | 4.0 | 20 Jan 2022 | 20 Jan 2022 |
BSDL files (1)
Resource title | 版本 | Latest update | ||
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ZIP | 3.0 | 21 Dec 2020 | 21 Dec 2020 |
质量与可靠性
产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
---|---|---|---|---|---|
STM32WB15CCU6 | 批量生产 | UFQFPN 48 7x7x0.55 mm | 工业 | Ecopack2 | |
STM32WB15CCU6E | 批量生产 | UFQFPN 48 7x7x0.55 mm | 工业 | Ecopack2 | |
STM32WB15CCU7 | 批量生产 | UFQFPN 48 7x7x0.55 mm | 工业 | Ecopack2 | |
STM32WB15CCU7E | 批量生产 | UFQFPN 48 7x7x0.55 mm | 工业 | Ecopack2 | |
STM32WB15CCY6TR | 批量生产 | WLCSP 49 3.3x3.4x0.6 P 0.4 mm | 工业 | Ecopack2 | |
STM32WB15CCY6TR
Package:
WLCSP 49 3.3x3.4x0.6 P 0.4 mmMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度(ºC) | Country of Origin | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | Number of Channels (typ) | Number of Channels (typ) | D/A Converters (typ) (12-bit) | Comparator | I/Os (High Current) | CAN (2.0) | CAN (FD) | SPI (typ) | I2S (typ) | USART (typ) | UART (typ) | Integrated op-amps | SMPS | Budgetary Price (US$)*/Qty | Country of Origin | Timers (typ) (16-bit) | Timers (typ) (32-bit) | Number of Channels (typ) | Number of Channels (typ) | Number of Channels (typ) | D/A Converters (typ) (12-bit) | Comparator | I/Os (High Current) | CAN (2.0) | CAN (FD) | SPI (typ) | I2S (typ) | USART (typ) | UART (typ) | Integrated op-amps | SMPS | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
最小值 | 最大值 | ||||||||||||||||||||||||||||||||||||||||||||
STM32WB15CCU6E | distributors 无法联系到经销商,请联系我们的销售办事处 | 批量生产 | 5A992.c | NEC | Tray | UFQFPN 48 7x7x0.55 mm | -40 | 85 | CHINA | 3 | 1 | 13 | - | - | - | 1 | 37 | - | - | 1 | - | 1 | 1 | - | Internal | | CHINA | 3 | 1 | 13 | - | - | - | 1 | 37 | - | - | 1 | - | 1 | 1 | - | Internal | ||
STM32WB15CCU6 | distributors 无法联系到经销商,请联系我们的销售办事处 | 批量生产 | 5A992.c | NEC | Tray | UFQFPN 48 7x7x0.55 mm | -40 | 85 | CHINA | 3 | 1 | 13 | - | - | - | 1 | 30 | - | - | 1 | - | 1 | 1 | - | Internal | | CHINA | 3 | 1 | 13 | - | - | - | 1 | 30 | - | - | 1 | - | 1 | 1 | - | Internal | ||
STM32WB15CCU7E | distributors 无法联系到经销商,请联系我们的销售办事处 | 批量生产 | 5A992.c | NEC | Tray | UFQFPN 48 7x7x0.55 mm | -40 | 105 | CHINA | 3 | 1 | 13 | - | - | - | 1 | 30 | - | - | 1 | - | 1 | 1 | - | Internal | | CHINA | 3 | 1 | 13 | - | - | - | 1 | 30 | - | - | 1 | - | 1 | 1 | - | Internal | ||
STM32WB15CCU7 | distributors 无法联系到经销商,请联系我们的销售办事处 | 批量生产 | 5A992.c | NEC | Tray | UFQFPN 48 7x7x0.55 mm | -40 | 105 | CHINA | 3 | 1 | 13 | - | - | - | 1 | 30 | - | - | 1 | - | 1 | 1 | - | - | | CHINA | 3 | 1 | 13 | - | - | - | 1 | 30 | - | - | 1 | - | 1 | 1 | - | - | ||
STM32WB15CCY6TR | distributors 无法联系到经销商,请联系我们的销售办事处 | 批量生产 | 5A992.c | NEC | Tape and Reel | WLCSP 49 3.3x3.4x0.6 P 0.4 mm | -40 | 85 | TAIWAN | 3 | 1 | 13 | - | - | - | 1 | 25 | - | - | 1 | - | 1 | 1 | - | Internal | | TAIWAN | 3 | 1 | 13 | - | - | - | 1 | 25 | - | - | 1 | - | 1 | 1 | - | Internal |
STM32WB15CCY6TR 批量生产