Teseo-LIV3F

批量生产
Design Win Education

小型GNSS模块

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产品概述

描述

The Teseo-LIV3F module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding TeseoIII single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS).

The Teseo-LIV3F modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone: the embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for several applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.

Within its 9.7x10.1 mm tiny size, Teseo-LIV3F is offerinDS12152g superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying to its dedicated 32 KHz Real Time Clock (RTC) oscillator.

Thanks to the embedded 16 Mbit flash Teseo-LIV3F offers many extra features such as data logging, 7 days autonomous assisted GNSS, FW reconfigurability as well as FW upgrades.

Teseo-LIV3F provides also the Autonomous Assisted GNSS able to predict satellite data based on previous observation of satellite.

Teseo-LIV3F module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40°C to 85°C.

  • 所有功能

    • Simultaneously multiconstellation
    • -163 dBm navigation sensitivity
    • 1.5 m CEP accuracy positioning
    • 16 Mbit embedded Flash for data logging and FW upgrade
    • 2.1 V to 4.3 V supply voltage range
    • Tiny LCC 18 pin package (9.7x10.1)
    • Operating temperature (-40°, 85°C)
    • Free FW configuration
    • 17 μW standby current and 75 mW tracking power consumption

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      EVB-LIV3F

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      AEK-COM-GNSST31

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      X-NUCLEO-GNSS1A1

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EDA符号、封装和3D模型

STMicroelectronics - Teseo-LIV3F

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质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
TESEO-LIV3F
批量生产
RF MODULE 工业 Ecopack2

TESEO-LIV3F

Package:

RF MODULE

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

RF MODULE

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
TESEO-LIV3F Available at distributors

经销商的可用性 TESEO-LIV3F

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
批量生产
7A994 NEC Tape and Reel RF MODULE -40 85 SOUTH KOREA

TESEO-LIV3F 批量生产

封装:
RF MODULE
ECCN (US):
7A994
Budgetary Price (US$)*/Qty:
-

产品型号:

TESEO-LIV3F

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

SOUTH KOREA

代理商名称

代理商库存报告日期:

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商