Teseo-LIV3FL

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Education

Tiny GNSS low power module

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产品概述

描述

The Teseo-LIV3FL module is an easy to use global navigation satellite system (GNSS) standalone low power module, embedding Teseo III single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS). The Teseo-LIV3FL modules bring the proven accuracy and robustness of Teseo III chips to the reach of everyone: the embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for several applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.
Within its 9.7x10.1 mm tiny size, Teseo-LIV3FL is offering superior accuracy thanks to the on-board temperature compensated crystal oscillator (TCXO) and a reduced time to first fix (TTFF) relying to its dedicated real time clock (RTC) oscillator.
Thanks to the embedded flash Teseo-LIV3FL offers many extra features such as data logging, 7 days autonomous assisted GNSS, FW reconfigurability as well as FW upgrades.
Teseo-LIV3FL provides also the autonomous assisted GNSS able to predict satellite data based on previous observation of satellite.
Teseo-LIV3FL module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40 °C to 85°C.
  • 所有功能

    • Simultaneous multi-constellation
    • -163 dBm tracking sensitivity
    • 1.5 m CEP position accuracy
    • Embedded Flash for data logging and FW upgrade
    • VCC/VBAT supply voltage range: from 1.75 V to 4.2 V
    • VCC_IO 1.8 V and 3.3 V
    • Tiny LCC 18 pin package (9.7x10.1)
    • Wide operating temperature range (from -40 °to 85 °C)
    • Free FW configuration
    • 17.7. μA standby current and 82.7 mW tracking power consumption

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工业

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    • 产品型号
      状态
      描述
      类型
      供应商

      EVB-LIV3FL

      预览

      TESEO LIV3FL low power module evaluation board

      GNSS IC评估板 --
      EVB-LIV3FL

      描述:

      TESEO LIV3FL low power module evaluation board

EDA符号、封装和3D模型

STMicroelectronics - Teseo-LIV3FL

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3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
TESEO-LIV3FL
预览
RF MODULE 工业 Ecopack2

TESEO-LIV3FL

Package:

RF MODULE

Material Declaration**:

Marketing Status

预览

Package

RF MODULE

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
TESEO-LIV3FL 无法联系到经销商,请联系我们的销售办事处
预览
7A994 NEC Tape And Reel RF MODULE -40 85 SOUTH KOREA 8.9 / 1k

TESEO-LIV3FL

供货状态

预览

ECCN (US)

7A994

Budgetary Price (US$)*/Qty

8.9 / 1k

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

RF MODULE

Operating Temperature (°C)

(最小值)

-40

(最大值)

85

Budgetary Price (US$)* / Qty

8.9 / 1k

Country of Origin

SOUTH KOREA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商