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The Teseo-LIV3R module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding Teseo III single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Glonass/BeiDou/QZSS).
The Teseo-LIV3R modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone. The certified module with optimized RF, embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for many, especially IoT applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.
Within its 9.7x10.1 mm tiny size, Teseo-LIV3R is offering superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying on its dedicated 32 KHz Real Time Clock (RTC) oscillator.
Teseo-LIV3R also provides server based Real Time Assisted GNSS.
Teseo-LIV3R module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40 °C to 85 °C.主要特性
- Simultaneous multi-constellation
- -163 dBm tracking sensitivity
- 1.5 m CEP position accuracy
- 2.1 V to 4.3 V supply voltage range
- Tiny LCC 18 pin package (9.7x10.1)
- Operating temperature (-40 °C, 85 °C)
- 17 μW standby current and 70 mW tracking power consumption
All tools & software
All resources
产品规格 (1)
| Resource title | Latest update | |||
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| 17 Jun 2019 |
17 Jun 2019
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应用手册 (1)
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| 16 Apr 2020 |
16 Apr 2020
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用户手册 (2)
| Resource title | Latest update | |||
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| 17 Jan 2019 |
17 Jan 2019
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| 13 Jun 2019 |
13 Jun 2019
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简报 (2)
| Resource title | Latest update | |||
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| 14 Apr 2020 |
14 Apr 2020
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| 14 Apr 2020 |
14 Apr 2020
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宣传册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 18 Jun 2019 |
18 Jun 2019
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Product Certifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Apr 2019 |
17 Apr 2019
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - Teseo-LIV3R
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TESEO-LIV3R |
批量生产
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RF MODULE | 工业 | Ecopack2 |
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TESEO-LIV3R
Package:
RF MODULEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| TESEO-LIV3R | 4 distributors | Buy Direct |
批量生产
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7A994 | NEC | Tape And Reel | RF MODULE | -40 | 85 | SOUTH KOREA | 7.3 / 1k | |
