产品概述
描述
This power module is a sixpack topology in an ACEPACK™ 2 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.
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所有功能
- ACEPACK™ 2 power module
- DBC Cu Al2O3 Cu
- Sixpack topology
- 1200 V, 75 A IGBTs and diodes
- Soft and fast recovery diode
- Integrated NTC
- ACEPACK™ 2 power module
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
Thermal-electrical Simulators for Components
STPOWER Studio
Start your design with the A2P75S12M3-F now
xwith our eDesignSuite online design aid utilities and simulation tools.
特别推荐
EDA符号、封装和3D模型
样片和购买
产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度(ºC) | Country of Origin | Budgetary Price (US$)*/Qty | ||
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最小值 | 最大值 | |||||||||||
A2P75S12M3-F | distributors 无法联系到经销商,请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tray | ACEPACK 2 | - | - | PHILIPPINES | |