产品概述
描述
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal performance substrate, which results in exceptional low on-resistance per unit area and excellent switching performance almost independent of temperature. A negative temperature sensor and three DC link capacitors are also included to optimize switching behavior.
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所有功能
- ACEPACK 2 power module
- 13 mΩ of typical RDS(on) each switch (2 dice in parallel per switch)
- 2.5 kVrms insulation voltage
- Integrated NTC temperature sensor
- DC link capacitors between DC BUS and neutral
- AIN DBC improved thermal performance
- Press fit contact pins
- ACEPACK 2 power module
特别推荐
EDA符号、封装和3D模型
STMicroelectronics - A2U12M12W2-F1C
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符号
封装
3D模型
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| A2U12M12W2-F1C | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tray | ACEPACK 2 | - | - | PHILIPPINES | | ||
distributors
无法联系到经销商，请联系我们的销售办事处
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