产品概述
描述
This SLLIMM (small low-loss intelligent molded module) nano provides a compact, high-performance AC motor drive in a simple, rugged design. It is composed of six MOSFETs and three half-bridge HVICs for gate driving, providing low electromagnetic interference (EMI) characteristics with optimized switching speed. The package is optimized for thermal performance and compactness in built-in motor applications, or other low power applications where assembly space is limited. This IPM includes an operational amplifier, completely uncommitted, and a comparator that can be used to design a fast and efficient protection circuit. SLLIMM is a trademark of STMicroelectronics.-
所有功能
- IPM 1 A, 500 V, RDS(on)= 3.6 Ω, 3-phase MOSFET inverter bridge including control ICs for gate driving
- Optimized for low electromagnetic interference
- 3.3 V, 5 V, 15 V CMOS/TTL input comparators with hysteresis and pull-down/pull-up resistors
- Undervoltage lockout
- Internal bootstrap diode
- Interlocking function
- Shutdown function
- Comparator for fault protection against overtemperature and overcurrent
- Op-amp for advanced current sensing
- Optimized pinout for easy board layout
- Up to ±2 kV ESD protection (HBM C = 100 pF, R = 1.5 kΩ)
All tools & software
全部资源
| Resource title | Latest update |
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产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 31 Jan 2020 | 31 Jan 2020 |
应用手册 (4)
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| 19 Mar 2021 | 19 Mar 2021 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 22 Nov 2018 | 22 Nov 2018 | |||
| 19 Mar 2021 | 19 Mar 2021 |
技术文档 (2)
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| 19 Mar 2021 | 19 Mar 2021 | |||
| 19 Mar 2021 | 19 Mar 2021 |
用户手册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Mar 2021 | 19 Mar 2021 |
简报 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Jul 2018 | 13 Jul 2018 | |||
| 07 Apr 2021 | 07 Apr 2021 | |||
| 20 Mar 2021 | 20 Mar 2021 |
宣传册 (5 of 6)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 23 Feb 2021 | 23 Feb 2021 | |||
| 06 May 2020 | 06 May 2020 | |||
| 04 May 2020 | 04 May 2020 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 04 May 2020 | 04 May 2020 | |||
| 14 Oct 2020 | 14 Oct 2020 |
EDA符号、封装和3D模型
STMicroelectronics - STIPN1M50-H
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| STIPN1M50-H | 批量生产 | NDIP-26L | 工业 | Ecopack2 | |
STIPN1M50-H
Package:
NDIP-26LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| STIPN1M50-H | 3 distributors | Buy Direct | 批量生产 | EAR99 | NEC | Tube | NDIP-26L | - | - | CHINA | 4.45 / 1k | |
