产品概述
描述
The BUXD87 is manufactured using High Voltage Multi Epitaxial Planar technology for high switching speeds and high voltage withstand capability.-
所有功能
- REVERSE PINS OUT Vs STANDARD IPAK/DPAK PACKAGE
- HIGH DC CURRENT GAIN
- HIGH VOLTAGE CAPABILITY
- SURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE IN TAPE & REEL (SUFFIX \"T4\")
- THROUGH-HOLE IPAK (TO-251) POWER PACKAGE IN TUBE (SUFFIX \"-1\")
EDA符号、封装和3D模型
STMicroelectronics - BUXD87
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符号
封装
3D模型
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| BUXD87T4 | 2 distributors | 批量生产 | EAR99 | NEC | Tape and Reel | DPAK | -65 | 150 | CHINA | | ||
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