产品概述
描述
This silicon carbide Power MOSFET device has been developed using ST’s advanced and innovative 3rd generation SiC MOSFET technology. The device features a very low RDS(on) over the entire temperature range combined with low capacitances and very high switching operations, which improve application performance in frequency, energy efficiency, system size and weight reduction.
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所有功能
- AEC-Q101 qualified
- Very low RDS(on) over the entire temperature range
- High speed switching performances
- Very fast and robust intrinsic body diode
- Very high operating junction temperature capability (TJ = 200 °C)
- Source sensing pin for increased efficiency
EDA符号、封装和3D模型
STMicroelectronics - SCTHS250N65G3
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符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
SPICE models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 04 Oct 2022 | 04 Oct 2022 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| SCTHS250N65G3AG | 批量生产 | STPAK | 汽车应用 | Ecopack2 | |
| SCTHS250N65G3TAG | 建议 | - | 工业 | - | |
SCTHS250N65G3AG
Package:
STPAKMaterial Declaration**:
SCTHS250N65G3TAG
Package:
-Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 封装 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 温度（ºC） | Operating Temperature (°C) (min) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| SCTHS250N65G3TAG | | | distributors 无法联系到经销商，请联系我们的销售办事处 | - | - | - | - | - | - | - | - | |||
| SCTHS250N65G3AG | | | distributors 无法联系到经销商，请联系我们的销售办事处 | STPAK | Tray | ITALY | EAR99 | NEC | - | - | - | |||
SCTHS250N65G3AG 批量生产