产品概述
描述
This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.
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所有功能
- AQG 324 qualified
- Half-bridge power module
- 650 V blocking voltage
- Fast recovery body diode
- Very low switching energies
- Low package inductance
- Dice on direct bond copper (DBC) substrate
- Low thermal resistance
- Isolation rating of 3.4 kVrms/min
精选 视频
意法半导体提供全新的高压MDmesh M6和M9 STPOWER MOSFET，这些产品采用紧凑且散热效率高的TO-LL表面贴装型封装，可同时提供高的电气和热效率、外形紧凑和节省空间等特性，适用于SMPS、数据中心和太阳能微逆变器等电源转换应用。这些器件具有附加的Kelvin源引脚，可减小接通/关断开关损耗，有助于设计人员进一步提高效率。
All tools & software
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
产品规格 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 28 Sep 2022 | 28 Sep 2022 |
应用手册 (5)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.1 | 13 Sep 2018 | 13 Sep 2018 | ||
| 2.0 | 10 May 2023 | 10 May 2023 | ||
| 1.4 | 13 Sep 2018 | 13 Sep 2018 | ||
| 1.3 | 13 Sep 2018 | 13 Sep 2018 | ||
| 1.1 | 13 Sep 2018 | 13 Sep 2018 |
技术文档 (4)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 19 Nov 2021 | 19 Nov 2021 | ||
| 1.0 | 13 Nov 2016 | 13 Nov 2016 | ||
| 2.4 | 11 Jul 2023 | 11 Jul 2023 | ||
| 1.1 | 11 Jul 2023 | 11 Jul 2023 |
用户手册 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.3 | 21 Oct 2016 | 21 Oct 2016 |
宣传册 (5 of 10)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 22 May 2023 | 22 May 2023 | ||
| 1.0 | 13 Apr 2023 | 13 Apr 2023 | ||
| 1.0 | 15 Sep 2021 | 15 Sep 2021 | ||
| 1.1 | 13 Apr 2023 | 13 Apr 2023 | ||
| 1.0 | 26 Jul 2023 | 26 Jul 2023 | ||
| 1.0 | 27 Feb 2022 | 27 Feb 2022 | ||
| 1.0 | 06 May 2022 | 06 May 2022 | ||
| 1.0 | 08 May 2020 | 08 May 2020 | ||
| 1.0 | 19 Nov 2021 | 19 Nov 2021 | ||
| 1.0 | 06 Oct 2020 | 06 Oct 2020 |
手册 (3)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 28 Apr 2022 | 28 Apr 2022 | ||
| 1.0 | 24 Jul 2020 | 24 Jul 2020 | ||
| 1.0 | 12 Oct 2021 | 12 Oct 2021 |
EDA符号、封装和3D模型
STMicroelectronics - SH68N65DM6AG
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| SH68N65DM6AG | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | ACEPACK SMIT | - | - | PHILIPPINES | | ||