产品概述
描述
This Power MOSFET is the latest development of STMicroelectronics unique \"single feature size\" stripbased process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.-
所有功能
- Exceptional dv/dt capability
- Low threshold drive
- 100% avalanche tested
精选 视频
Industry’s first 900 V MOSFETs with on-state resistance below 100 mΩ
Available in 10 different RDS(on) values and 9 packages
All tools & software
All resources
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产品规格 (1)
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| 19 Sep 2016 |
19 Sep 2016
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应用手册 (5 of 6)
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13 Sep 2018
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25 Oct 2016
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13 Sep 2018
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| 07 Jan 2019 |
07 Jan 2019
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13 Sep 2018
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| 13 Sep 2018 |
13 Sep 2018
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用户手册 (1)
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| 21 Oct 2016 |
21 Oct 2016
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宣传册 (1)
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| 08 May 2020 |
08 May 2020
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - STB80NF03L-04T4
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| STB80NF03L-04T4 |
批量生产
|
D2PAK | 汽车应用 | Ecopack1 |
|
STB80NF03L-04T4
Package:
D2PAKMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| STB80NF03L-04T4 | 3 distributors |
批量生产
|
EAR99 | NEC | Tape And Reel | D2PAK | - | - | CHINA | 1.861 / 1k | ||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
1.861 / 1k