STGSB200M65DF2AG

批量生产

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

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产品概述

描述

This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. The device is part of the M series IGBTs, which represent an optimal balance between inverter system performance and efficiency where the low-loss and the short-circuit functionality is essential. Furthermore, the positive VCE(sat) temperature coefficient and the tight parameter distribution result in safer paralleling operation. Thanks to the DBC substrate, the ACEPACK SMIT surface mounting power package offers a low thermal resistance coupled with a electrical isolated top side thermal pad.
  • 所有功能

    • AEC-Q101 qualified
    • 6 μs of minimum short-circuit withstand time
    • VCE(sat) = 1.65 V (typ.) @ IC = 200 A
    • Tight parameter distribution
    • Positive VCE(sat) temperature coefficient
    • Low thermal resistance
    • Maximum junction temperature: TJ = 175 °C
    • Dice on direct bond copper (DBC) substrate
    • Isolation rating of 3400 Vrms/min
    • UL recognition: UL 1557 file E81734

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STMicroelectronics - STGSB200M65DF2AG

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质量与可靠性

产品型号 Marketing Status 一般描述 封装 等级规格 符合RoHS级别 材料声明**
STGSB200M65DF2AG
批量生产
Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package ACEPACK SMIT 汽车应用 Ecopack2

STGSB200M65DF2AG

Package:

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

Material Declaration**:

Marketing Status

批量生产

General Description

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

Package

ACEPACK SMIT

Grade

Automotive

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Budgetary Price (US$)*/Qty
更多信息
最小值
最大值
STGSB200M65DF2AG 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape And Reel ACEPACK SMIT -40 175 12.675 / 50
更多信息

Country of Origin:

PHILIPPINES

一般描述:

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

STGSB200M65DF2AG

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

12.675 / 50

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

ACEPACK SMIT

Operating Temperature (°C)

(最小值)

-40

(最大值)

175

Budgetary Price (US$)* / Qty

12.675 / 50

Country of Origin

PHILIPPINES

一般描述

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商