技术说明
- Leadless packages with enhanced board level solder joint reliability for automotive application
- Mounting instructions for SMD (surface mounting device) packages
- Mounting instructions for THD (through-hole device) packages
- New I2PAKFP (TO-281) package, practical approach for compact and slim product design needs
Conference Paper
应用手册
- 45W USB Type-C™ PD adapter board with controllers STCH03 QR flyback,SRK1001 adaptive synchronous rectifier and STUSB4761 USB Type-C™ PD
- Guidelines for using ST's MOSFET smd Packages
- Impact of power MOSFET VGS on buck converter performance
- Intelligent power switches for 48 V battery applications
- Monolithic Schottky diode in ST F7 LV MOSFET technology: improving application performance
规格书
- Automotive N-channel 100 V, 4.2 mΩ typ., 110 A, STripFET F7 Power MOSFET in a TO-220 package
- Automotive N-channel 40 V, 1.35 mΩ typ., 120 A, STripFET™ F7 Power MOSFET in a PowerFLAT™ 5x6 package
- Automotive N-channel 40 V, 1.9 mΩ typ.,120 A STripFET™ H6 Power MOSFETs in H²PAK-2 and H²PAK-6 packages
- Automotive N-channel 40 V, 2.4 mΩ typ., 100 A, STripFET F7 Power MOSFET in an LFPAK 5x6 package
- Automotive N-channel 40 V, 3.6 mΩ, 5 A STripFET™ F6 Power MOSFET in a DPAK package