产品概述
描述
ESDALC6V1xxM6是一款单芯片阵列，设计用于保护高达4或5线免受ESD瞬变影响。 该器件非常适合需要节省印刷电路板空间、降低功率吸收能力的应用。-
所有功能
- 高ESD保护水平
- 高集成度
- 适用于高密度板
- 4线单向Transil二极管（ESDALC6V1M6）
- 5线单向Transil二极管（ESDALC6V1-5M6）
- 击穿电压：VBR= 6.1 V 最小值
- 低二极管电容（0 V时，典型值为12 pF）
- 低漏电流<70 nA
- PCB面积非常小：1.45 mm²
- 间距：500微米
- 无引线封装
- 符合下述标准
- IEC 61000-4-2
- 15 kV (air discharge)
- 8 kV (contact discharge)
- MIL STD 883G- Method 3015-7: class3B
- >8 kV (human body model)
- IEC 61000-4-2
电路原理图
精选 视频
During this one-hour webinar, you will learn how to make your electronic system more robust against destructive Electrostatic Discharges (ESD) by using ST ESD Protection components. During this webinar you will learn about: - ESD major root causes and EMC standards - ST ESD Protections, which can help to protect your application againts ESD - Many real application examples demonstrating where protections play an important role - How to select the best protection for your usecases
ESDCAN01-2BLY with up to 30 kV ESD and overvoltage protection, with high surge capability at high temperature
PEP01-5841, for Power over Ethernet supply lines
All tools & software
全部资源
| Resource title | Latest update |
|---|
产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 05 Oct 2015 | 05 Oct 2015 |
应用手册 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 06 Aug 2019 | 06 Aug 2019 | |||
| 24 Mar 2020 | 24 Mar 2020 | |||
| 09 Jul 2019 | 09 Jul 2019 |
技术文档 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 15 Feb 2013 | 15 Feb 2013 | |||
| 12 Dec 2014 | 12 Dec 2014 | |||
| 24 May 2021 | 24 May 2021 |
简报 (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 14 Apr 2021 | 14 Apr 2021 | |||
| 18 May 2015 | 18 May 2015 |
宣传册 (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 09 Apr 2021 | 09 Apr 2021 | |||
| 09 Apr 2021 | 09 Apr 2021 |
手册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 14 Apr 2021 | 14 Apr 2021 |
EDA符号、封装和3D模型
STMicroelectronics - ESDALC6V1-5M6
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
全部资源
| Resource title | Latest update |
|---|
CAD Symbol & Footprint models (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 02 Apr 2021 | 02 Apr 2021 | ||
| ZIP | 16 Mar 2020 | 16 Mar 2020 |
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Breakdown Voltage (V) (min) | Country of Origin | Budgetary Price (US$)*/Qty | 更多信息 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| ESDALC6V1-5M6 | 2 distributors | Buy Direct | 批量生产 | EAR99 | NEC | Tape And Reel | QFN-6L | - | - | 6.1 | CHINA | 0.087 / 1k | ||
