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样片和购买
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  • The ESDL031-1BF4 is a bidirectional single line TVS diode designed to protect the power line against EOS and ESD transients.

    The device is ideal for applications where board space saving is required.

    Key Features

    • Ultra-low clamping voltage: 6.3 V TLP at 16 A Ipp
    • Bidirectional protection diode
    • Very low dynamic resistance: 85 mΩ
    • Low leakage current: 100 nA max at 3.3 V VRM
    • ST0201 package
    • ECOPACK2 compliant component
    • Exceeds IEC 61000-4-2 level 4:
      • ±25 kV (contact discharge)
      • ±30 kV (air discharge)

样片和购买

产品型号
供货状态
Breakdown Voltage (V) (min)
封装
包装类型
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
ESDL031-1BF4
批量生产
5 ST0201 Tape And Reel 0.014 1000 EAR99 - 没有经销商,请联系我们的销售办事处

ESDL031-1BF4

供货状态

批量生产

Breakdown Voltage (V) (min)

5

单价(US$)

0.014*

封装

ST0201

包装类型

Tape And Reel

单价(US$)

0.014

数量

1000

ECCN (US)

EAR99

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

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设计工具

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      Transient voltage suppressor smart selection tool

开发工具硬件

    • 产品型号

      Protection product finder application for Android and iOS

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS13106
      3.3 V ultra-low clamping single line bidirectional ESD protection
      1.0
      444.71 KB
      PDF
      DS13106

      3.3 V ultra-low clamping single line bidirectional ESD protection

    • 描述 版本 文档大小 操作
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN5367
      SIMetrix / SIMPLIS: PSpice model import
      1.0
      948.16 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN5367

      SIMetrix / SIMPLIS: PSpice model import

    • 描述 版本 文档大小 操作
      TA0324
      ESD protection improvement in cellular handsets
      1.2
      134.94 KB
      PDF
      TN1200
      Micro-bump Flip Chip: package description and recommendations for use
      1.0
      280.7 KB
      PDF
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TA0324

      ESD protection improvement in cellular handsets

      TN1200

      Micro-bump Flip Chip: package description and recommendations for use

      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

演示和培训资料

    • 描述 版本 文档大小 操作
      HSP series portfolio overview : High-speed port ESD protection 1.0
      797.61 KB
      PDF
      Ultra-low capacitance single-line ESD protection portfolio overview: ‘Ultra Low’ (ULC) and ‘eXtra Low’ (XLC) capacitance ESD protection 1.0
      681.96 KB
      PDF

      HSP series portfolio overview : High-speed port ESD protection

      Ultra-low capacitance single-line ESD protection portfolio overview: ‘Ultra Low’ (ULC) and ‘eXtra Low’ (XLC) capacitance ESD protection

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      ST Protection Finder - The new app for Android and iOS 1.0
      1.52 MB
      PDF

      ST Protection Finder - The new app for Android and iOS

产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
ESDL031-1BF4
批量生产
ST0201 工业 Ecopack2

ESDL031-1BF4

Package:

ST0201

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

ST0201

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.