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The HSP061-2 is a 2-channel ESD array with a rail-to-rail architecture designed specifically for the protection of high speed differential lines.
The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps.
The HSP061-2M6 is packaged in μQFN-6L (1.45 x 1.0 mm) with a 500 μm pitch. The HSP061-2N4 is packaged in μQFN-4L (1.0 x 0.8 mm) with a 400 μm pitch.主要特性
- Flow-through routing to keep signal integrity
- Ultralarge bandwidth: 6 GHz
- Ultralow capacitance: 0.6 pF
- Low leakage current: 100 nA at 25 °C
- Extended operating junction temperature range: -40 °C to 150 °C
- RoHS compliant
样片和购买
| 产品型号 | 供货状态 | Breakdown Voltage (V) (min) | Directionality | 封装 | 包装类型 | 预算价格(US$) | 数量 | ECCN (US) | Country of Origin | 更多信息 | 从分销商订购 | 从ST订购 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HSP061-2M6 |
Active
|
6 | Uni-Directional | uQFN-6L | Tape And Reel | 0.144 | 100 | EAR99 | CHINA | 查看供货情况 | Get sample | |
| HSP061-2N4 |
Active
|
6 | Uni-Directional | uQFN-4L | Tape And Reel | 0.084 | 500 | EAR99 | CHINA | 查看供货情况 | Get sample |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
精选 视频
In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
Introduction to surges – EOS and ESD – definition, standards, effects and root cause
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| 产品型号 | 供货状态 | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| HSP061-2M6 |
Active
|
uQFN-6L | 工业 | Ecopack2 | |
| HSP061-2N4 |
Active
|
uQFN-4L | 工业 | Ecopack2 |
|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
