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The HSP061-8M16 is an 8-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The ultra-low variation of the capacitance ensures very low influence on signal-skew. The large bandwidth and the low reflection make it compatible with 3.4 Gbps.
The device is packaged in μQFN-16L with a 400 μm pitch, which minimizes the PCB area.主要特性
- Ultralarge bandwidth: 6.3 GHz
- Ultralow capacitance: 0.6 pF
- Low time domain reflection
- Low leakage current: 100 nA at 25 °C
- Extended operating junction temperature range: -40 °C to 150 °C
- Package size in mm: 3.3 x 1.5 x 0.55
- RoHS compliant
- Benefits
- High ESD robustness of the equipment
- Suitable for high density boards
- Complies with following standards
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MIL-STD 883G Method 3015-7 Class 3B:
- 8 kV
-
IEC 61000-4-2 level 4:
- 8 kV (contact discharge)
- 15 kV (air discharge)
-
MIL-STD 883G Method 3015-7 Class 3B:
精选 视频
In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
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硬件型号、CAD库及SVD (2)
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ZIP | 18 Nov 2019 |
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ZIP | 17 Mar 2020 |
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质量与可靠性
产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
---|---|---|---|---|---|
HSP061-8M16 |
NRND
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QFN-16L | 工业 | Ecopack2 |
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HSP061-8M16
Package:
QFN-16LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持 。
样片和购买
产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度(ºC) | Breakdown Voltage (V) (min) | Directionality | Country of Origin | Budgetary Price (US$)*/Qty | 更多信息 | ||
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最小值 | 最大值 | ||||||||||||||
HSP061-8M16 | 5 distributors | Buy Direct |
NRND
|
EAR99 | NEC | Tape And Reel | QFN-16L | -40 | 150 | 6 | Uni-Directional | CHINA | 0.28 / 100 |