产品概述
描述
The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.
The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device.
Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV.
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所有功能
- Packaged in lead-free Flip Chip
- Very low resistance: 0.35 Ω
- High attenuation: -45 dB at 900 MHz
- Very low PCB space consumption:0.89 mm x 1.26 mm
- Very thin package: 0.65 mm
- High efficiency in ESD suppressionIEC6 1000-4-2 level 4
- High reliability offered by monolithic integration
- High reduction of parasitic elements through integration and wafer level packaging
- Complies with the following standards
- IEC 61000-4-2 level 4:
- ±15 kV (air discharge)
- ±8 kV (contact discharge)
- IEC 61000-4-2 level 4:
EDA符号、封装和3D模型
STMicroelectronics - EMIF02-SPK02F2
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
HW Models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 01 Aug 2015 | 01 Aug 2015 |
CAD Symbol & Footprint models (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.1 | 11 Jun 2021 | 11 Jun 2021 | |
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | 封装 | 包装类型 | 温度（ºC） | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||
| EMIF02-SPK02F2 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | CSP P 0.5 mm | Tape and Reel | - | - | EAR99 | FRANCE | | ||
distributors
无法联系到经销商，请联系我们的销售办事处
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