产品概述
描述
The EMIF02-USB03F2 is a highly integrated array designed to suppress EMI / RFI noise for USB OTG (on-the-go) ports.
The EMIF02-USB03F2 Flip-Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV on external contacts.
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所有功能
- 2-line, low-pass filter + 2-line ESD protection
- High efficiency in EMI filtering
- Lead-free package
- Very low PCB space occupation: < 2.80 mm
- Very thin package: 0.65 mm
- High efficiency in ESD suppression (IEC 61000-4-2 level 4)
- High reliability offered by monolithic integration
- High reduction of parasitic elements through integration and wafer level packaging
EDA符号、封装和3D模型
全部资源
资源标题 | 版本 | 更新时间 |
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CAD Symbol & Footprint models (2)
资源标题 | 版本 | 更新时间 | ||
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ZIP | 1.0 | 11 Jun 2021 | 11 Jun 2021 | |
ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
样片和购买
产品型号 | Order from distributors | 从ST订购 | 供货状态 | 封装 | 包装类型 | 温度(ºC) | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | ||
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最小值 | 最大值 | ||||||||||
EMIF02-USB03F2 | distributors 无法联系到经销商,请联系我们的销售办事处 | 批量生产 | CSP P 0.5 mm | Tape and Reel | - | - | EAR99 | FRANCE | |
distributors
无法联系到经销商,请联系我们的销售办事处