产品概述
描述
The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard™ port filtering. The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size.
Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV. Compared to EMIF06-HMC01F2, the EMIF06-HMC02F2 has its ground balls connected together internally.
-
所有功能
- 6 lines low-pass-filter
- High efficiency in EMI filtering
- Very low PCB space consuming: < 4 mm²
- Lead-free package
- Very thin package: 0.65 mm
- High efficiency in ESD suppression
- High reliability offered by monolithic integration
- High reducing of parasitic elements through integration and wafer level packaging
EDA符号、封装和3D模型
STMicroelectronics - EMIF06-HMC02F2
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
CAD Symbol & Footprint models (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 11 Jun 2021 | 11 Jun 2021 | |
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| EMIF06-HMC02F2 | 批量生产 | CSP P 0.5 mm | 工业 | Ecopack2 | |
EMIF06-HMC02F2
Package:
CSP P 0.5 mmMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | 封装 | 包装类型 | 温度（ºC） | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||
| EMIF06-HMC02F2 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | CSP P 0.5 mm | Tape and Reel | - | - | EAR99 | FRANCE | | ||