产品概述
描述
The EMIF06-VID01F2 is a 6-line highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interference. The EMIF06-VID01F2 Flip Chip packaging means the package size is equal to the die size.Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.
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所有功能
- High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)
- Very thin package: 0.65 mm
- High reduction of parasitic elements through integration and wafer level packaging
- High efficiency EMI filtering (-40 dB @ 900 MHz)
- Low serial resistance for camera impedance adaptation
- Low line capacitance suitable for high speed data bus
- Optimized PCB space occupation: 2.92 mm x 1.29 mm
- High reliability offered by monolithic integration
- Lead-free package
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在一小时的网络研讨会中，您将学习如何使用意法半导体的ESD防护组件让您的电子系统更可靠地抵御破坏性静电放电(ESD)。日程：1）ESD根本原因和EMC标准，2）意法半导体的ESD 防护组件可以有助于您的应用抵御ESD影响，3）通过许多真实的应用示例说明防护组件可以在哪些方面发挥重要作用，4）如何选择最适合您用例的防护组件
特别推荐
EDA符号、封装和3D模型
STMicroelectronics - EMIF06-VID01F2
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
全部资源
| Resource title | 版本 | Latest update |
|---|
CAD Symbol & Footprint models (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 11 Jun 2021 | 11 Jun 2021 | |
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | 封装 | 包装类型 | 温度（ºC） | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||
| EMIF06-VID01F2 | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | CSP P 0.5 mm | Tape and Reel | - | - | EAR99 | FRANCE | | ||
无法联系到经销商，请联系我们的销售办事处
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