产品概述
描述
The EMIF06-VID01F2 is a 6-line highly integrated array designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interference.
The EMIF06-VID01F2 Flip Chip packaging means the package size is equal to the die size.
Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV.
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所有功能
- High efficiency in ESD suppression on inputs pins (IEC 61000-4-2 level 4)
- Very thin package: 0.65 mm
- High reduction of parasitic elements through integration and wafer level packaging
- High efficiency EMI filtering (-40 dB @ 900 MHz)
- Low serial resistance for camera impedance adaptation
- Low line capacitance suitable for high speed data bus
- Optimized PCB space occupation: 2.92 mm x 1.29 mm
- High reliability offered by monolithic integration
- Lead-free package
EDA符号、封装和3D模型
STMicroelectronics - EMIF06-VID01F2
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
CAD Symbol & Footprint models (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 11 Jun 2021 | 11 Jun 2021 | |
| ZIP | 1.2 | 18 Mar 2020 | 18 Mar 2020 |
样片和购买
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| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 封装 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 温度（ºC） | Operating Temperature (°C) (min) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| EMIF06-VID01F2 | | | distributors 无法联系到经销商，请联系我们的销售办事处 | CSP P 0.5 mm | Tape and Reel | FRANCE | EAR99 | - | - | - | ||||
EMIF06-VID01F2 批量生产
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
封装:
CSP P 0.5 mm
包装类型:
Tape and Reel
RoHS:
-
Country of Origin:
FRANCE
ECCN (US):
EAR99
ECCN (EU):
-
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