手册
产品介绍
技术说明
应用手册
- Flip Chip package description and recommendations for use
- HDMI ESD protection and signal conditioning products for STBs
- How to solve antenna desense issue with ECMF
- IPAD™ 400 µm Flip Chip: package description and recommendations for use
- IPAD™ 500 µm Flip Chip: package description and recommendations for use
规格书
- 20 V low clamping, low capacitance single line bidirectional ESD protection
- 3.3 V ultra-low clamping single line bidirectional ESD protection
- 4 and 5 line ESD protection in SOT666
- 4- and 5-line Transil™ arrays for ESD protection
- 4-line bidirectional Transil™, transient surge voltage suppressor for ESD protection