产品概述
描述
The HSP051-4M5 and HSP053-4M5 are a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The device is packaged in μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.
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所有功能
- Very compact 500 µm pitch package, for easy PCB layout
- Very-large bandwidth: 11.5 GHz (HSP051-4M5), 18 GHz (HSP053-4M5)
- Very-low capacitance: 0.35 pF (HSP051-4M5 - I/O to GND), 0.25 pF (HSP053-4M5 - I/O to GND)
- Low leakage current: < 1 nA
- High integration
- Suitable for high density boards
- Extended operating junction temperature range : -40 °C to 150 °C
- Exceeds IEC 61400-4-2 level standard:
- ±20 kV (HSP051-4M5, contact discharge)
- ±10 kV (HSP053-4M5, contact discharge)
- ±30 kV (HSP051-4M5, air discharge)
- ±25 kV (HSP053-4M5, air discharge)
特别推荐
EDA符号、封装和3D模型
STMicroelectronics - HSP053-4M5
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
SPICE models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 12 Aug 2022 | 12 Aug 2022 |
CAD Symbol & Footprint models (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 18 Jun 2021 | 18 Jun 2021 | |
| ZIP | 1.0 | 18 Jun 2021 | 18 Jun 2021 |
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Breakdown Voltage (V) (min) | Country of Origin | Budgetary Price (US$)*/Qty | 单价(US$) | Country of Origin | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||
| HSP053-4M5 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | QFN-5L | - | - | 5.3 | CHINA | | 0.056 | CHINA | ||
distributors
无法联系到经销商，请联系我们的销售办事处
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