产品概述
描述
The HSP061-2 is a 2-channel ESD array with a rail-to-rail architecture designed specifically for the protection of high speed differential lines.
The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps.
The HSP061-2M6 is packaged in μQFN-6L (1.45 x 1.0 mm) with a 500 μm pitch. The HSP061-2N4 is packaged in μQFN-4L (1.0 x 0.8 mm) with a 400 μm pitch.
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所有功能
- Flow-through routing to keep signal integrity
- Ultralarge bandwidth: 6 GHz
- Ultralow capacitance: 0.6 pF
- Low leakage current: 100 nA at 25 °C
- Extended operating junction temperature range: -40 °C to 150 °C
- RoHS compliant
EDA符号、封装和3D模型
STMicroelectronics - HSP061-2
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符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
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SPICE models (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 18 Nov 2019 | 18 Nov 2019 |
CAD Symbol & Footprint models (4)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 02 Apr 2021 | 02 Apr 2021 | |
| ZIP | 1.2 | 03 Sep 2020 | 03 Sep 2020 | |
| ZIP | 1.0 | 17 Jun 2021 | 17 Jun 2021 | |
| ZIP | 1.0 | 17 Mar 2020 | 17 Mar 2020 |