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CD21-Flash-CLAP

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Flash-based Secure Microcontroller compliant with Calypso Light Application (CLAP) Specification

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概述
Online design
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
开始
Partner products
Sales Briefcase

产品概述

描述

The CD21-Flash-CLAP device is a cost-effective, contactless secure microcontroller based on a 32-bit Arm® SecurCore® SC000™ RISC core. It is specifically designed for public transport applications, in that it provides a high level of security, high speed transactions and easy evolution capability for transport and multi-service applications.

  • 所有功能

      • 80 nm Flash memory technology
      • Transport application certifications:
        • Calypso® Light Application (CLAP)
        • Smart Ticketing Alliance in accordance with the CEN/TS 16794 standard
    • Platform
      • Native operating system
      • Single CLAP ticketing application
    • Hardware
      • ST31 product based on a 32-bit Arm® SecurCore® SC000™ RISC core
      • Advanced 80 nm Flash technology
      • Best-in-class RF performance
      • Common Criteria evaluation assurance level EAL5+
    • Standard
      • Calypso® standard compliant with the Calypso Light Application (CLAP) specifications
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特别推荐

全部资源

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Resource title
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产品规格 (1)

Resource title
Latest update
DB4426 Flash-memory-based secure microcontroller compliant with the Calypso® Light Application (CLAP) specifications 1.0
18 Feb 2021
18 Feb 2021
DB4426 Flash-memory-based secure microcontroller compliant with the Calypso® Light Application (CLAP) specifications 1.0

简报 (2)

Resource title
Latest update
Banking & ID secure solutions 1.2
14 Aug 2020
14 Aug 2020
Banking & ID secure solutions 1.2
Biometric SoC secure solutions 1.1
14 Apr 2021
14 Apr 2021
Biometric SoC secure solutions 1.1

宣传册 (3)

Resource title
Latest update
Biometric System-on-Card: A step ahead in security and privacy 1.0
26 Nov 2020
26 Nov 2020
Biometric System-on-Card: A step ahead in security and privacy 1.0
STPay to ease & secure your payment 1.1
23 Nov 2020
23 Nov 2020
STPay to ease & secure your payment 1.1
eGovernment & eID flexible and secure solutions 2.0
23 Nov 2020
23 Nov 2020
eGovernment & eID flexible and secure solutions 2.0

EDA符号、封装和3D模型

STMicroelectronics - CD21-Flash-CLAP

为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。

Symbols

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Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
ST31GCD21CLAP-W
批量生产
DICE 工业 N/A

ST31GCD21CLAP-W

Package:

DICE

Material Declaration**:

More Info

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度（ºC） Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ST31GCD21CLAP-W 无法联系到经销商，请联系我们的销售办事处
批量生产
3A991A2 NEC Not Applicable DICE - - FRANCE

ST31GCD21CLAP-W

供货状态

批量生产

ECCN (US)

3A991A2
更多信息

ECCN (EU)

NEC

包装类型

Not Applicable

封装

DICE

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Country of Origin

FRANCE

(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处 或我们的 经销商 。

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