Kerkey

批量生产

Security Module for Smart Metering system

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  • The Kerkey device implements the commands defined by the BSI for the Security Module of a Smart Meter Gateway as well as Global Platform v2.1.1 commands.

    主要特性

    • Protection profile for the Security Module of a Smart Meter Gateway (Security Module PP)
    • ECC support for NIST-P-256
    • Digital signature generation and verification with ECDSA
    • Key agreement with Diffie-Hellman (ECKA-ECDH) and El Gamal (ECKA-EG)
    • PACE with ECDH-GM-AES-CBC-CMAC-128 for secure messaging
    • On-chip ECC key pair generation
    • ISO7816-4 file system with EFs, DFs and ADFs, including nesting of DFs
    • Key pair, public key and PIN objects
    • Extended length APDUs
    • ECOPACK® 32-lead VFQFPN 5x5 mm (0.5 mm pitch)
    • Platform
      • Java Card™ inside (Version 2.2)
      • GlobalPlatform™ (Version 2.1.1)
      • ISO/IEC 7816 T=0 and T=1 contact protocols
      • Common personalization specification (CPS) compliant
    • Hardware
      • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes linear addressable memory
      • 80 Kbytes of User EEPROM including 128 bytes of User OTP area:
        • 30-year data retention at 25° C
        • 500,000 erase/write cycles at 25° C
        • 1 to 64 bytes Erase or Program in 1.5 ms
      • Operating temperature: –25° to +85° C
      • Enhanced NESCRYPT crypto-processor for public key cryptography
      • Hardware security enhanced DES accelerator
      • Contact assignment compatible with ISO/IEC 7816-3 standards
      • Asynchronous receiver transmitter (IART) for high speed serial data support (ISO/IEC 7816-3 and EMV™ compliant)
      • ESD protection greater then 6 kV (HBM)
      • 3V and 5V supply voltage ranges
      • EMVCo / CC (EAL6+) certification
    • Security
      • AIS-31 class P2 compliant true random number generator (TRNG)
      • Enhanced cryptographic algorithms:
        • DES/3DES, RSA, ECC and AES
        • SEED, SHA-1, SHA-256, MD5 and CRC16
        • Password Authenticated Connection Establishment (PACE) protocol
      • Differential power analysis (DPA) and differential fault analysis (DFA) countermeasures against side channel attacks
      • Active shield
      • ISO 3309 CRC calculation block
      • Memory protection unit (MPU)
      • Unique serial number on each die

样片和购买

产品型号
供货状态
封装
包装类型
ECCN (EU)
Country of Origin
Approximate Price (US$)* / Qty
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KERKEY
批⁠量⁠生⁠产
DICE Not Applicable NEC - 没有经销商,请联系我们的销售办事处

KERKEY

供货状态

批⁠量⁠生⁠产

单价(US$)

-

Approximate Price (US$)* / Qty

封装

DICE

包装类型

Not Applicable

ECCN (EU)

NEC

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

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产品型号 供货状态 封装 符合RoHS级别 材料声明**
KERKEY
批量生产
DICE N/A

KERKEY

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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