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从ST31安全微控制器到集成了NFC控制器、安全元件和eSIM的ST54解决方案,意法半导体为支付、运输和多种非接触式服务提供完整的解决方案。意法半导体的技术非常适合需要卡模式功能但又面临环境挑战或天线空间有限的应用。

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特别推荐

STPay-Boost and Fidesmo bring secure contactless transactions to wearables

STMicroelectronics and Fidesmo have created a turnkey active solution for secure contactless payments on smart watches and other wearable technology. The complete payment system-on-chip (SoC) is based on ST’s STPay-Boost IC, which combines a hardware secure element to protect transactions and a contactless controller featuring proprietary active-boost technology that maintains reliable NFC connections even in devices made with metallic materials. Its single-chip footprint fits easily within wearable form factors.

Fidesmo’s MasterCard MDES tokenization platform completes the solution by allowing the user to load the personal data needed for payment transactions. Convenient Over-The-Air (OTA) technology makes personalization a simple step for the user without any special equipment.

For more information about STPay-Boost, click here