嵌入式SIM或eSIM处于不断扩展的消费市场的核心,以实现直观易用、用户友好的移动应用。 它们的目标是广泛的电子器件,如可穿戴设备、平板电脑和手机,目的是提供最佳的无线连接体验。

随着移动设备变得更小,集成度更高,原始设备制造商将大大受益于ST的超小型封装eSIM IC,如UFDFN、QFN或WLCSP。

ST的eSIM解决方案基于广泛部署的ST33安全元件平台,为OTA数据传输以及新的移动网络运营商订阅的安全存储提供高安全级别的大容量存储和出色的性能。

STMicroelectronics Becomes First Chip Maker Accredited by the GSMA to Personalize eSIMs for Mobiles and Connected IoT Devices

Building on existing accreditation to manufacture eSIM chips that meet the GSMA’s specifications for security and reliability, ST is speeding ahead of other chip makers by gaining further accreditation for securely applying eSIM personalization data, according to the GSMA’s Secure Accreditation Scheme for UICC Production (GSMA SAS-UP). 

ST can now deliver personalized eSIMs, built around the proven ST33 secure microcontroller, directly to customers’ production facilities, ready to use with no further programming required. Equipment OEMs, mobile network operators, and SIM operating-system (OS) vendors can thus enjoy greater convenience, economy, and business efficiency by streamlining the eSIM supply chain to save handling overheads and reduce time to market. The eSIMs, customized with connection credentials, enable smaller form factors, greater security, and increased flexibility. 

More about ST’s GSMA certification here.

 

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