概述
样片和购买
解决方案
资源
工具与软件
质量与可靠性
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  • ST23YS08 devices are serial access secure microcontrollers custom-designed for secure smartcard applications.

    They are based on an enhanced STMicroelectronics 8/16-bit CPU core offering 16 Mbytes linear addressing space. They are manufactured using an advanced highly reliable ST CMOS EEPROM technology.

    主要特性

    • Hardware features
      • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes linear addressable memory
      • 108 Kbytes of User ROM
      • 2 Kbytes of User RAM
      • 8 Kbytes of User EEPROM including 64 bytes of User OTP area:
        • Highly reliable CMOS EEPROM submicron technology
        • 30-year data retention
        • 500,000 Erase/Write cycles endurance typical at 25° C
        • 1 to 32 bytes Erase or Program in 1.5 ms
      • Operating temperature: –25° to +85° C
      • Two 8-bit timers with watchdog and interrupt capability
      • 3 V and 5 V supply voltage ranges
      • External clock frequency up to 10 MHz
      • High performance provided by:
        • CPU clock frequency up to 29 MHz
      • Power-saving Standby state
      • Contact assignment compatible with ISO/IEC 7816-3 standards
      • Asynchronous receiver transmitter (IART) for high speed serial data support(ISO/IEC 7816-3 and EMV™ compliant)
      • ESD protection greater than 5 kV (HBM)
    • Security features
      • Active shield
      • Hardware security enhanced DES accelerator
      • Monitoring of environmental parameters
      • Protection mechanisms against faults
      • AIS-31 class P2 compliant true random number generator (TRNG)
      • ISO 3309 CRC calculation block
      • Unique serial number on each die
    • Development environment
      • Software development and firmware generation are supported by a comprehensive set of development tools dedicated to software design and validation:
        • C compiler, simulator and emulator

电路原理图

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技术文档

    • 描述 版本 文档大小 操作
      DB0417
      Secure MCU with enhanced security and 8-Kbyte high-density EEPROM
      2.1
      149.28 KB
      PDF
      DB0417

      Secure MCU with enhanced security and 8-Kbyte high-density EEPROM

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      Secure solutions portfolio 1.0
      1.48 MB
      PDF

      Secure solutions portfolio

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
ST23YS08
批量生产
DICE 工业 N/A

ST23YS08

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ST23YS08 没有经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Not Applicable DICE - - FRANCE

ST23YS08

供货状态

批量生产

ECCN (US)

EAR99

ECCN (EU)

NEC

包装类型

Not Applicable

封装

DICE

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商