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The ST23ZL34 is a serial access microcontroller custom-designed for secure smartcard applications.
It is based on an enhanced STMicroelectronics 8/16-bit CPU core offering 16 Mbytes of linear addressing space. ST23ZL34 devices are manufactured using an advanced highly reliable ST CMOS EEPROM technology.
Moreover, an ISO/IEC 7816-3 EMV-compliant asynchronous receiver transmitter (IART) communication peripheral is available.主要特性
- Hardware features
- Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory
- 300 Kbytes of User ROM
- 6 Kbytes of User RAM
- 2 Kbytes of NESCRYPT RAM
- 34 Kbytes of User EEPROM including 128 bytes of User OTP area:
- Highly reliable CMOS EEPROM submicron technology
- 30-year data retention
- 500,000 Erase/Write cycles endurance typical at 25° C
- 1 to 64 bytes Erase or Program in 1.5 ms
- Three 8-bit timers with watchdog and interrupt capability
- 3.3 V and 5 V supply voltage ranges
- External clock frequency up to 10 MHz
- High performance provided by:
- CPU clock frequency up to 27 MHz
- Power-saving Idle state
- Contact assignment compatible with ISO/IEC 7816-3 standards
- Asynchronous receiver transmitter (IART) for high speed serial data support (ISO/IEC 7816-3 and EMV™ compliant)
- ESD protection greater than 5 kV (HBM)
- Security features
- Active shield
- Enhanced NESCRYPT crypto-processor for public key cryptography
- Hardware security enhanced DES accelerator
- Monitoring of environmental parameters
- Protection mechanisms against faults
- AIS-31 class P2 compliant true random number generator (TRNG)
- ISO/IEC 13239 CRC calculation block
- Memory protection unit (MPU)
- Unique serial number on each die
- Development environment
- Software development and firmware generation are supported by a comprehensive set of development tools dedicated to software design and validation: C compiler, Simulator and Emulator
- Hardware features
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| 产品型号 | 供货状态 | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| ST23ZL34 | 批量生产 | DICE | Industrial | N/A | |
ST23ZL34
Package:
DICEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
