产品概述
-
所有功能
- Hardware features
- Arm® Cortex®-M3 32-bit RISC core
- 12 Kbytes of user RAM
- 512 Kbytes of user Flash memory with a one-time programmable (OTP) area
- 10-year data retention at 105 °C, or 15 years at 85 °C
- 500 000 Erase/Write cycles per page
- 50 million Erase/Write cycles per 64 Kbyte sector
- Page granularity of 128 bytes
- Block granularity: 1 Kbyte
- 128 bytes of user OTP area
- Page Erase time 4 ms
- Block Erase (1 Kbyte) in 20 ms
- Programming performance up to 10 μs/byte
- Flash memory Erase/Write protection software programmable on 64-Kbyte sectors
- Asynchronous receiver transmitter supporting ISO 7816-3 T=0 and T=1 protocols
- Two 16-bit timers with interrupt capability
- 1.8 V, 3 V and 5 V supply voltage ranges
- External clock frequency from 1 MHz up to 7.5 MHz
- High performance provided by:
- CPU clock frequency up to 15 MHz
- External clock multiplier (2x, 3x, and 4x)
- Current consumption compatible with the GSM (global system for mobile communications) and ETSI (European telecommunications standards institute) specifications
- Power-saving Standby state
- Contact assignment compatible with ISO 7816-2
- Electrostatic disturbance (ESD) protection greater than 4 kV (human body model)
- 8-pin DFN (5 × 6 mm) ECOPACK package
- Security features
- Monitoring of environmental parameters
- Protection against faults
- ISO 3309 cyclic redundancy check (CRC) calculation block
- True random number generator
- Unique serial number on each die
- Hardware data encryption standard (DES) accelerator
- Software features
- Flash memory loader
- Flash memory drivers
- Development environment
- Software development and firmware generation are supported by a comprehensive set of development tools dedicated to software design and validation:
- C compiler
- Simulator
- Emulator
- Software development and firmware generation are supported by a comprehensive set of development tools dedicated to software design and validation:
- Hardware features
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 05 Apr 2019 | 05 Apr 2019 |
手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 19 Mar 2021 | 19 Mar 2021 |
EDA符号、封装和3D模型
STMicroelectronics - ST32F512M
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| ST32F512M | 批量生产 | DICE | 工业 | N/A | |
ST32F512M
Package:
DICEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
