产品概述
描述
The ST33GTPMASPI is a cost-effective and high-performance trusted platform module (TPM) targeting automotive and embedded systems.
The product implements the functions defined by the Trusted Computing Group (www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Library Specifications version 2.0 Level 0 Revision 138 and errata version 1.4. It is also based on the TCG PC client-specific TPM Platform specifications rev1.03. The applicable protection profile is TCG Protection Profile for PC Client Specific TPM 2.0.
The product also supports the ability to upgrade the TPM firmware thanks to a persistent Flash memory loader application to support new standard evolutions.
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所有功能
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- AEC-Q100 qualified
- TPM features
- Flash-memory-based Trusted Platform Module (TPM)
- TPM 2.0 compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
- Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
- SP800-193 compliant for protection, detection and recovery requirements
- Targeted certifications:
- CC according to TPM 2.0 PP at EAL4+
- FIPS 140-2 level 2
- (physical security level 3)
- SPI support at up to 18 MHz
- Support for hardware physical presence
- Hardware features
- Arm® SecurCore® SC300™ 32-bit RISC core
- Highly reliable Flash memory technology:
- 500 000 cycles on the full temperature range
- 25 years’ lifetime at 85 °C
- 20 years’ lifetime at 105 °C
- Automotive grade 2: −40 °C to 105 °C
- ESD (electrostatic discharge) protection against voltages greater than 4 kV (HBM)
- 1.8 V or 3.3 V supply voltage range
- 20-lead thin shrink small outline ECOPACK MSL1 package
- Security features
- Active shield and environmental sensors
- Monitoring of environmental parameters (power and clock)
- Hardware and software protection against fault injection
- SP800-90A-compliant deterministic random bit generator (DRBG) built with an AIS-31 class PTG2-compliant true random generator (TRNG)
- Cryptographic algorithms:
- RSA key generation (1024 or 2048 bits)
- RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
- RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
- SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
- HMAC SHA-1, SHA-2 and SHA-3
- AES-128,192 and 256 bits
- TDES 192 bits
- ECC (NIST P-256, P-384 curves): Key generation, ECDH and ECDSA, ECSchnorr
- ECDAA (BN-256 curve)
- Device provided with 3 EK and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
- Device provisioned with 3 RSA key pairs to reduce the TPM provisioning time
- Product compliance
- Compliant with TCG test suite for TPM 2.0
- Common Criteria certifications:
- EAL 4+ on TCG TPM2.0 protection profile
- EAL 5+ on hardware
- Targets FIPS 140-2 level 2 certification (physical security level 3)
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特别推荐
Recommended documentation
EDA符号、封装和3D模型
STMicroelectronics - ST33GTPMASPI
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| ST33GTPMASPIS20 | 批量生产 | TSSOP-20 | 汽车应用 | N/A | |
ST33GTPMASPIS20
Package:
TSSOP-20Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| ST33GTPMASPIS20 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 3A991.a.2 | NEC | Tape and Reel | TSSOP-20 | 0 | - | FRANCE | | ||