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ST33GTPMASPI

批量生产
储存到myST

Automotive TPM 2.0 device with an SPI interface

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  • The ST33GTPMASPI is a cost-effective and high-performance trusted platform module (TPM) targeting automotive and embedded systems.

    The product implements the functions defined by the Trusted Computing Group (www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Library Specifications version 2.0 Level 0 Revision 138 and errata version 1.4. It is also based on the TCG PC client-specific TPM Platform specifications rev1.03. The applicable protection profile is TCG Protection Profile for PC Client Specific TPM 2.0.
    The product also supports the ability to upgrade the TPM firmware thanks to a persistent Flash memory loader application to support new standard evolutions.

    主要特性

      • AEC-Q100 qualified
    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • TPM 2.0 compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
      • SP800-193 compliant for protection, detection and recovery requirements
      • Targeted certifications:
        • CC according to TPM 2.0 PP at EAL4+
        • FIPS 140-2 level 2
        • (physical security level 3)
      • SPI support at up to 18 MHz
      • Support for hardware physical presence
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology:
        • 500 000 cycles on the full temperature range
        • 25 years’ lifetime at 85 °C
        • 20 years’ lifetime at 105 °C
      • Automotive grade 2: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection against voltages greater than 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
      • 20-lead thin shrink small outline ECOPACK MSL1 package
    • Security features
      • Active shield and environmental sensors
      • Monitoring of environmental parameters (power and clock)
      • Hardware and software protection against fault injection
      • SP800-90A-compliant deterministic random bit generator (DRBG) built with an AIS-31 class PTG2-compliant true random generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024 or 2048 bits)
        • RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
        • RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
        • SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
        • HMAC SHA-1, SHA-2 and SHA-3
        • AES-128,192 and 256 bits
        • TDES 192 bits
        • ECC (NIST P-256, P-384 curves): Key generation, ECDH and ECDSA, ECSchnorr
        • ECDAA (BN-256 curve)
        • Device provided with 3 EK and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
        • Device provisioned with 3 RSA key pairs to reduce the TPM provisioning time
    • Product compliance
      • Compliant with TCG test suite for TPM 2.0
      • Common Criteria certifications:
        • EAL 4+ on TCG TPM2.0 protection profile
        • EAL 5+ on hardware
      • Targets FIPS 140-2 level 2 certification (physical security level 3)
    阅读更多 阅读较少信息

特别推荐

All resources

产品规格 (1)

Resource title
Latest update
DB3982 Flash-memory-based TPM 2.0 device for automotive applications with an SPI interface 2.0
20 Dec 2019
20 Dec 2019
DB3982 Flash-memory-based TPM 2.0 device for automotive applications with an SPI interface 2.0

技术文档 (1)

Resource title
Latest update
TN1330 ST Trusted Platform Module (TPM) endorsement key (EK) certificates 1.0
03 Jun 2020
03 Jun 2020
TN1330 ST Trusted Platform Module (TPM) endorsement key (EK) certificates 1.0

简报 (3)

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30 Mar 2020
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17 Sep 2020
17 Sep 2020
Secure automotive solutions 1.0

宣传册 (3)

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Latest update
Digital key system for secure NFC car access 1.0
17 Jul 2020
17 Jul 2020
Digital key system for secure NFC car access 1.0
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手册 (1)

Resource title
Latest update
Secure solutions portfolio 1.0
23 Nov 2020
23 Nov 2020
Secure solutions portfolio 1.0

EDA Symbols, Footprints and 3D Models

STMicroelectronics - ST33GTPMASPI

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
ST33GTPMASPIS20
批量生产
TSSOP 20 工业 N/A

ST33GTPMASPIS20

Package:

TSSOP 20

Material Declaration**:

More Info

Marketing Status

批量生产

Package

TSSOP 20

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度（ºC） Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ST33GTPMASPIS20 无法联系到经销商，请联系我们的销售办事处
批量生产
EAR99 NEC Tape And Reel TSSOP 20 0 - FRANCE

ST33GTPMASPIS20

供货状态

批量生产

ECCN (US)

EAR99
更多信息

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

TSSOP 20

Operating Temperature (°C)

(最小值)

0

(最大值)

-

Country of Origin

FRANCE

(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处 或我们的 经销商 。