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ST33GTPMII2C

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Industrial TPM 2.0 device with an I2C interface

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样片和购买

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The ST33GTPMII2C is a cost-effective and high-performance trusted platform module (TPM) targeting industrial embedded systems.

The product implements the functions defined by the Trusted Computing Group (www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Library Specifications version 2.0 Level 0 Revision 138 and errata version 1.4. It is also based on the TCG PC client-specific TPM Platform specifications rev1.03. The applicable protection profile is TCG Protection Profile for PC Client Specific TPM 2.0.
The product also supports the ability to upgrade the TPM firmware thanks to a persistent Flash memory loader application to support new standard evolutions.

主要特性
- TPM features
  
  Flash-memory-based trusted platform module (TPM)
  
  Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
  
  Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
  
  SP800-193 compliant for protection, detection and recovery requirements
  
  Targeted certifications:
  CC according to TPM 2.0 PP at EAL4+
  FIPS 140-2 level 2 (physical security level 3)
  
  TCG certification
  
  I²C support at up to 200 kHz
  
  Supports up to 4 GPIOs mapped with NV storage indices
- Hardware features
  
  Arm^® SecurCore^® SC300™ 32-bit RISC core
  
  Highly reliable Flash memory technology:
  500 000 cycles on the full temperature range
  Data retention: 17 years at 85 °C and 10 years at 105 °C
  
  ESD (electrostatic discharge) protection against voltages greater than 4 kV (HBM)
  
  1.8 V, 3.3 V or 5 V supply voltage range
  
  Industrial qualification (JEDEC)
  
  Wafer-level chip-scale package (WLCSP) JEDEC J-STD-020D-compliant MSL1 package
- Security features
  
  Active shield and environmental sensors
  
  Monitoring of environmental parameters (power and clock)
  
  Hardware and software protection against fault injection
  
  FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
  
  Cryptographic algorithms:
  RSA key generation (1024 or 2048 bits)
  RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
  RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
  SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
  HMAC SHA-1, SHA-2 and SHA-3
  AES-128,192 and 256 bits
  TDES 192 bits
  ECC (NIST P-256, P-384 curves): key generation, ECDH and ECDSA, ECSchnorr
  ECDAA (BN-256 curve)
  Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
  Device provisioned with 3 RSA key pairs to reduce the TPM provisioning time
- Product compliance
  
  Compliant with TCG test suite for TPM 2.0
  
  Common Criteria certifications:
  EAL 4+ on TCG TPM2.0 protection profile
  EAL 5+ on hardware
  
  Targets FIPS 140-2 level 2 certification (physical security level 3)
阅读更多阅读较少信息

All resources

产品规格 (1)

	Resource title		Latest update
PDF	DB4281 Flash-memory-based TPM2.0 device for industrial applications with an I²C interface 1.0		07 Sep 2020	07 Sep 2020 DB4281 Flash-memory-based TPM2.0 device for industrial applications with an I²C interface 1.0

技术文档 (1)

	Resource title		Latest update
PDF	TN1330 ST Trusted Platform Module (TPM) endorsement key (EK) certificates 1.0		03 Jun 2020	03 Jun 2020 TN1330 ST Trusted Platform Module (TPM) endorsement key (EK) certificates 1.0

简报 (1)

	Resource title		Latest update
PDF	Authentication and IoT secure solutions 1.0		24 Aug 2020	24 Aug 2020 Authentication and IoT secure solutions 1.0

手册 (4)

	Resource title	Latest update
PDF	Make LoRa® easy and secure 1.0	28 Aug 2018	28 Aug 2018 Make LoRa® easy and secure 1.0
PDF	Making Sigfox devices easy and secure 1.0	17 Jul 2020	17 Jul 2020 Making Sigfox devices easy and secure 1.0
PDF	STSAFE for authentication and embedded security 1.0	13 Aug 2020	13 Aug 2020 STSAFE for authentication and embedded security 1.0
PDF	Secure solutions portfolio 1.0	23 Nov 2020	23 Nov 2020 Secure solutions portfolio 1.0

EDA Symbols, Footprints and 3D Models

质量与可靠性

产品型号	Marketing Status	封装	符合RoHS级别	材料声明**
ST33GTPMII2C	批量生产	WLCSP K8H 12 600 FLOW ST	N/A

ST33GTPMII2C

Package:

WLCSP K8H 12 600 FLOW ST

Material Declaration**:

More Info

Marketing Status

Package

WLCSP K8H 12 600 FLOW ST

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系销售支持。

样片和购买

	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	温度（ºC）		Country of Origin	Budgetary Price (US$)*/Qty
	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	最小值	最大值	Country of Origin	Budgetary Price (US$)*/Qty
	ST33GTPMII2C	无法联系到经销商，请联系我们的销售办事处		批量生产	EAR99	NEC	Tape And Reel	WLCSP K8H 12 600 FLOW ST	0	70	FRANCE

ST33GTPMII2C

供货状态

批量生产

ECCN (US)

EAR99

更多信息

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

WLCSP K8H 12 600 FLOW ST

Operating Temperature (°C)

(最小值)

(最大值)

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处或我们的经销商。

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ST33GTPMII2C