ST33KTPM2XI2C

批量生产
Design Win

TPM 2.0 devices with an SPI or I2C interface

下载数据摘要

产品概述

描述

The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile, and computing applications.

It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity, and authenticity of information and devices.

The STSAFE-TPM devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.

They target Common Criteria, TCG, and FIPS certification.

The ST33KTPM2XSPI offers a slave serial peripheral interface (SPI) by default whereas the ST33KTPM2XI2C offers exclusively a slave SPI or a slave I²C interface. Both devices are compliant with the TCG PC Client TPM Profile specifications.

It offers resilience services during the TPM firmware upgrade process, and self-recovery of TPM firmware and critical data upon failure detection.

The ST33KTPM2XSPI and ST33KTPM2XI2C operate in the –40 °C to 105 °C extended temperature range.

The device is offered in the UFQFPN32 ECOPACK2 package. ECOPACK is an ST trademark.

  • 所有功能

    • TPM features
      • Flash-memory-based trusted platform module (TPM)
      • Compliant with Trusted Computing Group (TCG) trusted platform module (TPM) Library specifications 2.0, revision 1.59 errata version 1.3 and TCG PC Client Platform TPM Profile (PTP) for TPM 2.0 Version 1.05
      • Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
      • SP800-193 compliant for protection, detection and recovery requirements
      • Targeted certifications:
        • Common Criteria in compliance with the TPM 2.0 protection profile (augmented with AVA_VAN.5, resistant to high-potential attacks)
        • FIPS 140-3
        • TCG certification
      • SPI support at up to 66 MHz
      • I²C communication bus running at up to 1 Mb/s
    • Hardware features
      • Highly reliable flash memory with error correction code
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
    • Security features
      • Active shield
      • Monitoring of environmental parameters
      • Hardware and software protection against fault injection
      • FIPS SP800-90A and AIS20-compliant deterministic random-bit generator (DRBG)
      • FIPS SP800-90B and AIS31-compliant true random-number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024, 2048, 3072 and 4096 bits)
        • RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
        • RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
        • SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
        • HMAC SHA-1, SHA-2 and SHA-3
        • AES-128,192 and 256 bits
        • ECC (NIST P-256, P-384 curves): key generation, ECDH and ECDSA, ECSchnorr
        • ECDAA (BN-256 curve)
      • Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
      • Device provisioned with three 2048-bit RSA key pairs to reduce the TPM provisioning time
    • Product's targeted compliance
      • Compliant with Microsoftt ® Windows® 10 and 11
      • Compliant with Linux® drivers
      • Compliant with Intel® vPro® technology
      • Compliant with TCG test suite for TPM 2.0
      • Compliant with the open-source TCG TPM 2.0 TSS implementation

EDA符号、封装和3D模型

STMicroelectronics - ST33KTPM2XI2C

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 符合RoHS级别 材料声明**
ST33KTPM2X32CKE3
批量生产
UFQFPN 32 5x5x0.55 mm Ecopack2

ST33KTPM2X32CKE3

Package:

UFQFPN 32 5x5x0.55 mm

Material Declaration**:

Marketing Status

批量生产

Package

UFQFPN 32 5x5x0.55 mm

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ST33KTPM2X32CKE3 Available at distributors

经销商的可用性 ST33KTPM2X32CKE3

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape and Reel UFQFPN 32 5x5x0.55 mm 0 70 THAILAND

ST33KTPM2X32CKE3 批量生产

封装:
UFQFPN 32 5x5x0.55 mm
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

ST33KTPM2X32CKE3

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

0

Max:

70

Country of Origin:

THAILAND

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商