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ST33TPHF20SPI

批量生产
储存到myST

具有TCG SPI接口的可信平台模块2.0

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样片和购买
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产品概述

描述

The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark. It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against advanced forms of attack.
The ST33TPHF20SPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
The ST33TPHF20SPI supports TPM 2.0 commands exclusively, and offers 112 Kbytes of user-dedicated non-volatile memory.
The ST33TPHF20SPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

  • 所有功能

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
      • Common Criteria (CC) certification according to the TPM 2.0 protection profiles at EAL4+
      • FIPS 140-2 level 2 certification
      • SPI support for up to 33 MHz in FIFO and CRB protocol modes
      • Support for software and hardware physical presence
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
      • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
    • Security features
      • Active shield and environmental sensors
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS-compliant random-number generator (RNG) built on an SP800-90A compliant SHA256 deterministic random bit generator (DRBG) and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA (Rivest-Shamir-Adleman) key generation (1024 or 2048 bits)
        • RSA signature and encryption
        • Hash-based message authentication code (HMAC) SHA-1 & SHA-256
        • Advanced Encryption Standard (AES)-128-192-256
        • Elliptic curve cryptography (ECC) 224 & 256 bits
        • Elliptic curve Diffie–Hellman (ECDH) 224 & 256 bits
        • Elliptic curve direct anonymous attestation (ECDAA)
    • Product compliance
      • TPM 2.0 compliant with Microsoft Windows 8.1 and 10
      • Compliant with Intel TXT
      • TPM 2.0 compliant with the corresponding TCG test suites
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EDA符号、封装和3D模型

STMicroelectronics - ST33TPHF20SPI

为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 符合RoHS级别 材料声明**
ST33HTPH2028AHD1
NRND
TSSOP-28 Ecopack2
ST33HTPH2032AHD1
批量生产
VFQFPN 32 5x5x1.0 mm Ecopack2

ST33HTPH2028AHD1

Package:

TSSOP-28

Material Declaration**:

PDF XML
More Info

Marketing Status

NRND

Package

TSSOP-28

RoHS Compliance Grade

Ecopack2

ST33HTPH2032AHD1

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML
More Info

Marketing Status

批量生产

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度（ºC） Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ST33HTPH2028AHD1 无法联系到经销商，请联系我们的销售办事处
NRND
EAR99 NEC Tape And Reel TSSOP-28 0 70 PHILIPPINES
ST33HTPH2032AHD1 无法联系到经销商，请联系我们的销售办事处
批量生产
EAR99 NEC Tape And Reel VFQFPN 32 5x5x1.0 mm 0 70 PHILIPPINES

ST33HTPH2028AHD1

供货状态

NRND

ECCN (US)

EAR99
更多信息

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

TSSOP-28

Operating Temperature (°C)

(最小值)

0

(最大值)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

ST33HTPH2032AHD1

供货状态

批量生产

ECCN (US)

EAR99
更多信息

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

VFQFPN 32 5x5x1.0 mm

Operating Temperature (°C)

(最小值)

0

(最大值)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处 或我们的 经销商。