产品概述
描述
The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark. It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against advanced forms of attack.
The ST33TPHF20SPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
The ST33TPHF20SPI supports TPM 2.0 commands exclusively, and offers 112 Kbytes of user-dedicated non-volatile memory.
The ST33TPHF20SPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.
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所有功能
- TPM features
- Flash-memory-based Trusted Platform Module (TPM)
- Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
- TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
- Common Criteria (CC) certification according to the TPM 2.0 protection profiles at EAL4+
- FIPS 140-2 level 2 certification
- SPI support for up to 33 MHz in FIFO and CRB protocol modes
- Support for software and hardware physical presence
- Hardware features
- Arm® SecurCore® SC300™ 32-bit RISC core
- Highly reliable Flash memory technology
- Extended temperature range: −40 °C to 105 °C
- ESD (electrostatic discharge) protection up to 4 kV (HBM)
- 1.8 V or 3.3 V supply voltage range
- 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
- Security features
- Active shield and environmental sensors
- Monitoring of environmental parameters (power)
- Hardware and software protection against fault injection
- FIPS-compliant random-number generator (RNG) built on an SP800-90A compliant SHA256 deterministic random bit generator (DRBG) and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
- Cryptographic algorithms:
- RSA (Rivest-Shamir-Adleman) key generation (1024 or 2048 bits)
- RSA signature and encryption
- Hash-based message authentication code (HMAC) SHA-1 & SHA-256
- Advanced Encryption Standard (AES)-128-192-256
- Elliptic curve cryptography (ECC) 224 & 256 bits
- Elliptic curve Diffie–Hellman (ECDH) 224 & 256 bits
- Elliptic curve direct anonymous attestation (ECDAA)
- Product compliance
- TPM 2.0 compliant with Microsoft Windows 8.1 and 10
- Compliant with Intel TXT
- TPM 2.0 compliant with the corresponding TCG test suites
- TPM features
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All tools & software
All resources
| Resource title | Latest update |
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产品规格 (1)
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|---|---|---|---|---|
| 15 Nov 2019 | 15 Nov 2019 |
技术文档 (2)
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| 03 Jun 2020 | 03 Jun 2020 | |||
| 15 May 2020 | 15 May 2020 |
简报 (1)
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| 02 Feb 2021 | 02 Feb 2021 |
宣传册 (1)
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|---|---|---|---|---|
| 19 Mar 2021 | 19 Mar 2021 |
手册 (4)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 28 Aug 2018 | 28 Aug 2018 | |||
| 17 Jul 2020 | 17 Jul 2020 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 19 Mar 2021 | 19 Mar 2021 |
TPM Certificates (5 of 6)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 29 Jul 2019 | 29 Jul 2019 | ||
| ZIP | 29 Jul 2019 | 29 Jul 2019 | ||
| ZIP | 29 Jul 2019 | 29 Jul 2019 | ||
| ZIP | 29 Jul 2019 | 29 Jul 2019 | ||
| ZIP | 29 Jul 2019 | 29 Jul 2019 | ||
| ZIP | 29 Jul 2019 | 29 Jul 2019 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ST33TPHF20SPI
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
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3D models
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| ST33HTPH2028AHD1 | NRND | TSSOP-28 | Ecopack2 | |
| ST33HTPH2032AHD1 | 批量生产 | VFQFPN 32 5x5x1.0 mm | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| ST33HTPH2028AHD1 | 无法联系到经销商，请联系我们的销售办事处 | NRND | EAR99 | NEC | Tape And Reel | TSSOP-28 | 0 | 70 | PHILIPPINES | |||
| ST33HTPH2032AHD1 | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape And Reel | VFQFPN 32 5x5x1.0 mm | 0 | 70 | PHILIPPINES | |||
供货状态
NRNDECCN (US)
EAR99Budgetary Price (US$)*/Qty
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
