ST33TPHF2ESPI

批量生产

具有TCG SPI接口的可信平台模块1.2和2.0

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  • The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.

    It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
    These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
    The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
    They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against advanced forms of attack.
    The ST33TPHF2ESPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
    The ST33TPHF2ESPI supports two exclusive modes that support either TPM 1.2 or TPM 2.0 commands. The product can be locked irreversibly in TPM 1.2 or TPM 2.0 mode during provisioning, or only after provisioning to provide a smooth migration between TPM 1.2 and TPM 2.0.
    The ST33TPHF2ESPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
    The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

    主要特性

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0 command set
      • Supporting dynamic switch from one mode to another and capability to lock one mode irreversibly
      • For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.3
      • For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
      • Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0 protection profiles at EAL4+
      • FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0
      • SPI support for up to 33 MHz in FIFO and CRB protocol modes
      • Support for software and hardware physical presence for TPM 1.2 and TPM 2.0
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
      • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
    • Security features
      • Active shield and environmental sensors
      • Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2 and TPM 2.0 modes
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024 or 2048 bits)
        • RSA signature and encryption
        • HMAC SHA-1 & SHA-256
        • AES-128-192-256
        • ECC 224 & 256 bits
    • Product compliance
      • TPM 1.2 compliant with Microsoft® Windows® 7, 8.1 and 10
      • TPM 2.0 compliant with Microsoft Windows 10
      • Compliant with Intel® TXT for TPM1.2 and TPM 2.0 in SPI FIFO mode
      • TPM 1.2 and TPM 2.0 compliant with the respective TCG test suites

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - ST33TPHF2ESPI

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质量与可靠性

产品型号 Marketing Status 封装 符合RoHS级别 材料声明**
ST33HTPH2E28AHD0
批量生产
TSSOP28 9.7 x 4.4 Ecopack2
ST33HTPH2E32AHD0
批量生产
VFQFPN 32 5x5x1.0 Ecopack2

ST33HTPH2E28AHD0

Package:

TSSOP28 9.7 x 4.4

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

TSSOP28 9.7 x 4.4

RoHS Compliance Grade

Ecopack2

ST33HTPH2E32AHD0

Package:

VFQFPN 32 5x5x1.0

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFQFPN 32 5x5x1.0

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ST33HTPH2E32AHD0 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape And Reel VFQFPN 32 5x5x1.0 0 70 PHILIPPINES
ST33HTPH2E28AHD0 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape And Reel TSSOP28 9.7 x 4.4 0 70 PHILIPPINES

ST33HTPH2E32AHD0

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

VFQFPN 32 5x5x1.0

Operating Temperature (°C)

(最小值)

0

(最大值)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

ST33HTPH2E28AHD0

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

TSSOP28 9.7 x 4.4

Operating Temperature (°C)

(最小值)

0

(最大值)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商