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  • The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.

    It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
    These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
    The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
    They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against advanced forms of attack.
    The ST33TPHF2ESPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
    The ST33TPHF2ESPI supports two exclusive modes that support either TPM 1.2 or TPM 2.0 commands. The product can be locked irreversibly in TPM 1.2 or TPM 2.0 mode during provisioning, or only after provisioning to provide a smooth migration between TPM 1.2 and TPM 2.0.
    The ST33TPHF2ESPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
    The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

    主要特性

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0 command set
      • Supporting dynamic switch from one mode to another and capability to lock one mode irreversibly
      • For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.3
      • For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
      • Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0 protection profiles at EAL4+
      • FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0
      • SPI support for up to 33 MHz in FIFO and CRB protocol modes
      • Support for software and hardware physical presence for TPM 1.2 and TPM 2.0
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
      • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
    • Security features
      • Active shield and environmental sensors
      • Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2 and TPM 2.0 modes
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024 or 2048 bits)
        • RSA signature and encryption
        • HMAC SHA-1 & SHA-256
        • AES-128-192-256
        • ECC 224 & 256 bits
    • Product compliance
      • TPM 1.2 compliant with Microsoft® Windows® 7, 8.1 and 10
      • TPM 2.0 compliant with Microsoft Windows 10
      • Compliant with Intel® TXT for TPM1.2 and TPM 2.0 in SPI FIFO mode
      • TPM 1.2 and TPM 2.0 compliant with the respective TCG test suites

样片和购买

产品型号
供货状态
数量
预算价格(US$)
封装
包装类型
ECCN (EU)
Country of Origin
从分销商订购
从ST订购
ST33TPHF2ESPIQFN
批量生产
- - VFQFPN 32 5x5x1.0 Tape And Reel NEC - 没有经销商,请联系我们的销售办事处
ST33TPHF2ESPIR28
批量生产
- - TSSOP28 9.7 x 4.4 Tape And Reel NEC - 没有经销商,请联系我们的销售办事处

ST33TPHF2ESPIQFN

供货状态

批量生产

数量

-

单价(US$)

*

单价(US$)

-

封装

VFQFPN 32 5x5x1.0

包装类型

Tape And Reel

ECCN (EU)

NEC

Country of Origin

-

ST33TPHF2ESPIR28

供货状态

批量生产

数量

-

单价(US$)

*

单价(US$)

-

封装

TSSOP28 9.7 x 4.4

包装类型

Tape And Reel

ECCN (EU)

NEC

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

评估工具

    • 产品型号

      TPM development kit

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DB2716
      Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
      3.0
      412.23 KB
      PDF
      DB2716

      Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      STSAFE-TPM Standardized solution for trusted devices 1.0
      195 KB
      PDF

      STSAFE-TPM Standardized solution for trusted devices

    • 描述 版本 文档大小 操作
      STSAFE - Secure Solutions for IoT 1.0
      1.12 MB
      PDF

      STSAFE - Secure Solutions for IoT

Digital Certificates

    • 描述 版本 文档大小 操作
      GlobalSign Trusted Computing CA 1.0
      928 Byte(s)
      ZIP
      GlobalSign Trusted Platform Module ECC Root CA 1.0
      693 Byte(s)
      ZIP
      ST Intermediate CA 05 1.0
      1.04 KB
      ZIP
      ST TPM Root Certificates 1.0
      1.07 KB
      ZIP
      ST Trusted Platform Module (TPM) endorsement key (EK) certificates 4.0
      185.14 KB
      PDF
      STM TPM ECC Intermediate CA 01 1.0
      691 Byte(s)
      ZIP
      STM TPM ECC Root CA 01 1.0
      800 Byte(s)
      ZIP

      GlobalSign Trusted Computing CA

      GlobalSign Trusted Platform Module ECC Root CA

      ST Intermediate CA 05

      ST TPM Root Certificates

      ST Trusted Platform Module (TPM) endorsement key (EK) certificates

      STM TPM ECC Intermediate CA 01

      STM TPM ECC Root CA 01

产品型号 供货状态 封装 符合RoHS级别 材料声明**
ST33TPHF2ESPIQFN
批量生产
VFQFPN 32 5x5x1.0 Ecopack1
ST33TPHF2ESPIR28
批量生产
TSSOP28 9.7 x 4.4 Ecopack2

ST33TPHF2ESPIQFN

Package:

VFQFPN 32 5x5x1.0

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFQFPN 32 5x5x1.0

RoHS Compliance Grade

Ecopack1

ST33TPHF2ESPIR28

Package:

TSSOP28 9.7 x 4.4

Material Declaration**:

Marketing Status

批量生产

Package

TSSOP28 9.7 x 4.4

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.