产品概述

描述

They embed an Arm® SecurCore® SC300™ processor with additional security features to help protect against advanced forms of attack. The ST33TPHF2XI2C offers an I²C interface compliant with the TCG PC Client TPM Profile specifications.
It offers resilience services during the TPM firmware upgrade process, and self-recovery of TPM firmware and critical data upon failure detection.
The ST33TPHF2XI2C operates in the –25 to +85 °C commercial temperature range at 1.8 V, or in the –40 °C to 105 °C extended temperature range at 3.3 V.
The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

所有功能
TPM features

Flash-memory-based Trusted Platform Module (TPM)

For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03

Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)

SP800-193 compliant for protection, detection and recovery requirements

Targeted certifications:
CC according to TPM 2.0 PP at EAL4+ (with AVA_VAN.5), resistant to high potential attacks
FIPS 140-2 level 2 (physical security level 3)
TCG certification

I²C support at up to 400 kHz

Supports up to 4 GPIOs mapped on NV storage indices

Hardware features

Arm^® SecurCore^® SC300™ 32-bit RISC core

Highly reliable Flash memory technology

Extended temperature range: −40 °C to 105 °C

ESD (electrostatic discharge) protection up to 4 kV (HBM)

1.8 V or 3.3 V supply voltage range

Security features

Active shield and environmental sensors

Monitoring of environmental parameters (power)

Hardware and software protection against fault injection

FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)

Cryptographic algorithms:
RSA key generation (1024 or 2048 bits)
RSA signature (RSASSA-PSS, RSASSAPKCS1v1_5)
RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
HMAC SHA-1, SHA-2 and SHA-3
AES-128, 192 and 256 bits
TDES-192 bits
ECC (NIST P-256, P-384 curves): key generation, ECDH and ECDSA, EC-Schnorr
ECDAA (BN-256 curve)

Device provided with 3 EK and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)

Device provisioned with 3 RSA key pairs to reduce the TPM provisioning time

Product compliance

TPM 2.0 compliant with Microsoft Windows Internet of things (IoT) core

Compliant with TCG test suite for TPM 2.0
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MCU 及 MPU嵌入式软件

产品型号	状态	描述	类型	供应商
STACKFORCE mioty® Protocol Stack for end points	批量生产	mioty Protocol Stack for end nodes, implementing the new ETSI standard TS 103357.	STM32第三方嵌入式软件	STACKFORCE	STACKFORCE mioty® Protocol Stack for end points 描述: mioty Protocol Stack for end nodes, implementing the new ETSI standard TS 103357.

Product Evaluation Tools

产品型号	状态	描述	类型	供应商
STPM4RasPI	批量生产	TPM开发套件	安全微控制器评估板	--	STPM4RasPI 描述: TPM开发套件

All resources

Expand all categories

	Resource title		Latest update

产品规格 (1)

	Resource title		Latest update
PDF	DB3957 Long-term evolution TPM 2.0 device with an I²C interface 3.0		19 Mar 2021	19 Mar 2021 DB3957 Long-term evolution TPM 2.0 device with an I²C interface 3.0

技术文档 (1)

	Resource title		Latest update
PDF	TN1330 ST Trusted Platform Module (TPM) endorsement key (EK) certificates 1.0		03 Jun 2020	03 Jun 2020 TN1330 ST Trusted Platform Module (TPM) endorsement key (EK) certificates 1.0

简报 (1)

	Resource title		Latest update
PDF	Authentication and IoT secure solutions 1.1		02 Feb 2021	02 Feb 2021 Authentication and IoT secure solutions 1.1

宣传册 (1)

	Resource title		Latest update
PDF	STSAFE-TPM standardized solution for trusted devices 2.0		19 Mar 2021	19 Mar 2021 STSAFE-TPM standardized solution for trusted devices 2.0

手册 (4)

	Resource title	Latest update
PDF	Make LoRa® easy and secure 1.0	28 Aug 2018	28 Aug 2018 Make LoRa® easy and secure 1.0
PDF	Making Sigfox devices easy and secure 1.0	17 Jul 2020	17 Jul 2020 Making Sigfox devices easy and secure 1.0
PDF	STSAFE for authentication and embedded security 1.0	19 Mar 2021	19 Mar 2021 STSAFE for authentication and embedded security 1.0
PDF	Secure solutions portfolio 1.0	19 Mar 2021	19 Mar 2021 Secure solutions portfolio 1.0

TPM Certificates (2)

	Resource title		Latest update
ZIP	STM TPM ECC Intermediate CA 02 1.0		29 Jul 2019	29 Jul 2019 STM TPM ECC Intermediate CA 02 1.0
ZIP	STM TPM ECC384 Intermediate CA 01 1.0		29 Jul 2019	29 Jul 2019 STM TPM ECC384 Intermediate CA 01 1.0

EDA Symbols, Footprints and 3D Models

质量与可靠性

产品型号	Marketing Status	封装	符合RoHS级别	材料声明**
ST33HTPH2X32AHD5	批量生产	VFQFPN 32 5x5x1.0 mm	Ecopack2	PDF XML

ST33HTPH2X32AHD5

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML

More Info

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系销售支持。

样片和购买

	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	温度（ºC）		Country of Origin	Budgetary Price (US$)*/Qty
	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	最小值	最大值	Country of Origin	Budgetary Price (US$)*/Qty
	ST33HTPH2X32AHD5	无法联系到经销商，请联系我们的销售办事处		批量生产	EAR99	NEC	Tape And Reel	VFQFPN 32 5x5x1.0 mm	0	70	PHILIPPINES