产品概述
描述
The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark. It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
They embed an Arm® SecurCore® SC300™ processor with additional security features to help protect against advanced forms of attack.
The ST33TPHF2XSPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
It offers resilience services during the TPM firmware upgrade process, and self-recovery of TPM firmware and critical data upon failure detection.
The ST33TPHF2XSPI operates in the –25 to +85 °C commercial temperature range at 1.8 V, or in the –40 °C to 105 °C extended temperature range at 3.3 V.
The device is offered in the VFQFPN32 ECOPACK2 package. ECOPACK is an ST trademark.
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所有功能
- TPM features
- Flash-memory-based Trusted Platform Module (TPM)
- Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
- Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
- SP800-193 compliant for protection, detection and recovery requirements
- Targeted certifications:
- CC according to TPM 2.0 PP at EAL4+(AVA_VAN.5, resistant to high-potential attacks)
- FIPS 140-2 level 2 (physical security level 3)
- TCG certification
- SPI support at up to 33 MHz
- Hardware features
- Arm® SecurCore® SC300™ 32-bit RISC core
- Highly reliable Flash memory technology
- Extended temperature range: −40 °C to 105 °C
- ESD (electrostatic discharge) protection up to 4 kV (HBM)
- 1.8 V or 3.3 V supply voltage range
- Security features
- Active shield and environmental sensors
- Monitoring of environmental parameters (power)
- Hardware and software protection against fault injection
- FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
- Cryptographic algorithms:
- RSA key generation (1024 or 2048 bits)
- RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
- RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
- SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
- HMAC SHA-1, SHA-2 and SHA-3
- AES-128,192 and 256 bits
- TDES 192 bits
- ECC (NIST P-256, P-384 curves): key generation, ECDH and ECDSA, ECSchnorr
- ECDAA (BN-256 curve)
- Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
- Device provisioned with 3 RSA key pairs to reduce the TPM provisioning time
- Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
- Device provisioned with 3 RSA key pairs to reduce the TPM provisioning time
- Product compliance
- Compliant with Microsoft® Windows® 10
- Compliant with Linux® drivers
- Compliant with Intel® vPro® technology
- Compliant with TCG test suite for TPM 2.0
- Compliant with the open-source TCG TPM 2.0 TSS implementation
- TPM features
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All resources
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产品规格 (1)
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| 22 Mar 2021 | 22 Mar 2021 |
技术文档 (1)
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| 03 Jun 2020 | 03 Jun 2020 |
简报 (1)
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| 02 Feb 2021 | 02 Feb 2021 |
宣传册 (1)
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| 19 Mar 2021 | 19 Mar 2021 |
手册 (4)
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| 28 Aug 2018 | 28 Aug 2018 | |||
| 17 Jul 2020 | 17 Jul 2020 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 19 Mar 2021 | 19 Mar 2021 |
TPM Certificates (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 29 Jul 2019 | 29 Jul 2019 | ||
| ZIP | 29 Jul 2019 | 29 Jul 2019 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ST33TPHF2XSPI
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| ST33HTPH2X32AHD4 | 批量生产 | VFQFPN 32 5x5x1.0 mm | Ecopack2 | |
| ST33HTPH2X32AHD8 | 批量生产 | VFQFPN 32 5x5x1.0 mm | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| ST33HTPH2X32AHD4 | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape And Reel | VFQFPN 32 5x5x1.0 mm | 0 | 70 | PHILIPPINES | |||
| ST33HTPH2X32AHD8 | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape And Reel | VFQFPN 32 5x5x1.0 mm | 0 | 70 | PHILIPPINES | |||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
