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ST33TPHF2XSPI

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Long-term evolution TPM 2.0 device with an SPI interface

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The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.

It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified
They embed an Arm SecurCore SC300 processor with additional security features to help protect against advanced forms of attack.
The ST33TPHF2XSPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
It offers resilience services during the TPM firmware upgrade process, and self-recovery of TPM firmware and critical data upon failure detection.
The ST33TPHF2XSPI operates in the –25 to +85 °C commercial temperature range at 1.8 V, or in the –40 °C to 105 °C extended temperature range at 3.3 V.
The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

主要特性
- TPM features
  
  Flash-memory-based Trusted Platform Module (TPM)
  
  Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
  
  Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
  
  SP800-193 compliant for protection, detection and recovery requirements
  
  Targeted certifications:
  CC according to TPM 2.0 PP at EAL4+(AVA_VAN.5, resistant to high-potential attacks)
  FIPS 140-2 level 2 (physical security level 3)
  TCG certification
  
  SPI support at up to 33 MHz
- Hardware features
  
  Arm^® SecurCore^® SC300™ 32-bit RISC core
  
  Highly reliable Flash memory technology
  
  Extended temperature range: −40 °C to 105 °C
  
  ESD (electrostatic discharge) protection up to 4 kV (HBM)
  
  1.8 V or 3.3 V supply voltage range
- Security features
  
  Active shield and environmental sensors
  
  Monitoring of environmental parameters (power)
  
  Hardware and software protection against fault injection
  
  FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
  
  Cryptographic algorithms:
  RSA key generation (1024 or 2048 bits)
  RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
  RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
  SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
  HMAC SHA-1, SHA-2 and SHA-3
  AES-128,192 and 256 bits
  TDES 192 bits
  ECC (NIST P-256, P-384 curves): key generation, ECDH and ECDSA, ECSchnorr
  ECDAA (BN-256 curve)
  
  Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
  
  Device provisioned with 3 RSA key pairs to reduce the TPM provisioning time
- Product compliance
  
  Compliant with Microsoft Windows 10
  
  Compliant with Linux^® drivers
  
  Compliant with Intel vPro technology
  
  Compliant with TCG test suite for TPM 2.0
  
  Compliant with the open-source TCG TPM 2.0 TSS implementation
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All tools & software

安全MCU软件

产品型号	状态	描述	类型	供应商
STSW-STSA110-SSL	批量生产	STSAFE-A integration within OpenSSL security stack	安全微控制器软件	ST	STSW-STSA110-SSL 描述: STSAFE-A integration within OpenSSL security stack

All resources

产品规格 (1)

	Resource title		Latest update
PDF	DB3421 Long-term evolution Flash-memory-based TPM 2.0 device with an SPI interface 4.0		26 Jun 2020	26 Jun 2020 DB3421 Long-term evolution Flash-memory-based TPM 2.0 device with an SPI interface 4.0

技术文档 (1)

	Resource title		Latest update
PDF	TN1330 ST Trusted Platform Module (TPM) endorsement key (EK) certificates 1.0		03 Jun 2020	03 Jun 2020 TN1330 ST Trusted Platform Module (TPM) endorsement key (EK) certificates 1.0

简报 (1)

	Resource title		Latest update
PDF	Authentication and IoT secure solutions 1.0		24 Aug 2020	24 Aug 2020 Authentication and IoT secure solutions 1.0

宣传册 (1)

	Resource title		Latest update
PDF	STSAFE-TPM standardized solution for trusted devices 2.0		02 Dec 2020	02 Dec 2020 STSAFE-TPM standardized solution for trusted devices 2.0

手册 (4)

	Resource title	Latest update
PDF	Make LoRa® easy and secure 1.0	28 Aug 2018	28 Aug 2018 Make LoRa® easy and secure 1.0
PDF	Making Sigfox devices easy and secure 1.0	17 Jul 2020	17 Jul 2020 Making Sigfox devices easy and secure 1.0
PDF	STSAFE for authentication and embedded security 1.0	13 Aug 2020	13 Aug 2020 STSAFE for authentication and embedded security 1.0
PDF	Secure solutions portfolio 1.0	23 Nov 2020	23 Nov 2020 Secure solutions portfolio 1.0

TPM Certificates (2)

	Resource title		Latest update
ZIP	STM TPM ECC Intermediate CA 02 1.0		29 Jul 2019	29 Jul 2019 STM TPM ECC Intermediate CA 02 1.0
ZIP	STM TPM ECC384 Intermediate CA 01 1.0		29 Jul 2019	29 Jul 2019 STM TPM ECC384 Intermediate CA 01 1.0

EDA Symbols, Footprints and 3D Models

质量与可靠性

产品型号	Marketing Status	封装	符合RoHS级别	材料声明**
ST33HTPH2X32AHD4	批量生产	VFQFPN 32 5x5x1.0 mm	Ecopack2	PDF XML
ST33HTPH2X32AHD8	批量生产	VFQFPN 32 5x5x1.0 mm	Ecopack2	PDF XML

ST33HTPH2X32AHD4

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML

More Info

Marketing Status

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

ST33HTPH2X32AHD8

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML

More Info

Marketing Status

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系销售支持。

样片和购买

产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	温度（ºC）		Country of Origin	Budgetary Price (US$)*/Qty
产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	最小值	最大值	Country of Origin	Budgetary Price (US$)*/Qty
ST33HTPH2X32AHD4	无法联系到经销商，请联系我们的销售办事处		批量生产	EAR99	NEC	Tape And Reel	VFQFPN 32 5x5x1.0 mm	0	70	PHILIPPINES
ST33HTPH2X32AHD8	无法联系到经销商，请联系我们的销售办事处		批量生产	EAR99	NEC	Tape And Reel	VFQFPN 32 5x5x1.0 mm	0	70	PHILIPPINES

ST33HTPH2X32AHD4

供货状态

批量生产

ECCN (US)

EAR99

更多信息

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

VFQFPN 32 5x5x1.0 mm

Operating Temperature (°C)

(最小值)

(最大值)

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

ST33HTPH2X32AHD8

供货状态

批量生产

ECCN (US)

EAR99

更多信息

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

VFQFPN 32 5x5x1.0 mm

Operating Temperature (°C)

(最小值)

(最大值)

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处或我们的经销商。

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