产品概述
-
所有功能
- TPM features
- Flash-memory-based trusted platform module (TPM)
- Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 159 – errata 1.1 and TCG PC Client Specific TPM Platform Specifications 1.05 rev 14
- Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
- SP800-193 compliant for protection, detection and recovery requirements
- Targeted certifications:
- CC according to TPM 2.0 PP at EAL4+ (augmented with AVA_VAN.5 and ALC_FLR.1)
- FIPS 140-2 level 2 (physical security level 3)
- TCG certification
- SPI support at up to 33 MHz
- Hardware features
- Highly reliable Flash memory technology
- Extended temperature range: −40 °C to 105 °C
- ESD protection up to 4 kV (HBM) and 750 V (CDM)
- 1.8 V or 3.3 V supply voltage range
- Security features
- Active shield and environmental sensors
- Monitoring of environmental parameters (power)
- Hardware and software protection against fault injection
- FIPS SP800-90A and AIS20-compliant deterministic random-bit generator (DRBG)
- FIPS SP800-90B and AIS31-compliant true random-number generator (TRNG)
- Cryptographic algorithms:
- RSA key generation (1024, 2048 or 3072 bits)
- RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
- RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
- SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
- HMAC SHA-1, SHA-2, and SHA-3
- AES-128, 192, and 256 bits
- TDES 192 bits
- ECC (NIST P-256, P-384 curves): key generation, ECDH, and ECDSA, ECSchnorr
- ECDAA (BN-256 curve)
- Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
- Device provisioned with three 2048-bit RSA key pairs to reduce the TPM provisioning time
- Product compliance
- Compliant with Microsoft® Windows® 10 and 11
- Compliant with Linux® drivers
- Compliant with Intel® vPro® technology
- Compliant with the TCG test suite for TPM 2.0
- Compliant with the open-source TCG TPM 2.0 TSS implementation
- TPM features
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STMicroelectronics - ST33TPHF2XSPI
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| ST33HTPH2X32AHD4 | 批量生产 | VFQFPN 32 5x5x1.0 mm | Ecopack2 | |
| ST33HTPH2X32AHD8 | 批量生产 | VFQFPN 32 5x5x1.0 mm | Ecopack2 | |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| ST33HTPH2X32AHD4 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | VFQFPN 32 5x5x1.0 mm | 0 | 70 | PHILIPPINES | | ||
| ST33HTPH2X32AHD8 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | VFQFPN 32 5x5x1.0 mm | 0 | 70 | PHILIPPINES | | ||
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