ST33TPM12I2C

批量生产

Trusted Platform Module with I2C interface based on 32-bit ARM® SecurCore® SC300 CPU

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  • The ST33TPM12I2C is a cost-effective and high performance Trusted Platform Module (TPM) targeting embedded system applications.

    This device implements the functions defined by the Trusted Computing Group (www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Specifications version 1.2 Level 2 Revision 116 ([1][2][3]), and is also based on the TCG PC Client specific TPM interface specifications 1.21 [5] and the PC Client implementation specification for conventional BIOS [6] for what concerns the TPM internal register list and bit definitions.
    The ST33TPM12I2C is based on a secure MCU hardware platform.
    The ST33TPM12I2C is built on a 32-bit ARM® reduced instruction set computing (RISC) processor which provides high cryptographic and general performances. A crypto-processor NESCRYPT is also present to support efficiently all public key cryptographic algorithms.

    主要特性

    • TPM features
      • Single-chip Trusted Platform Module (TPM)
      • Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116
      • Based on TCG PC Client Specific TPM Interface Specifications 1.21
      • Fully based on the common criteria (CC) EAL4+ certified LPC version ST33TPM12LPC
      • I2C support in Standard mode (100 kHz) and Fast mode (400 kHz), supporting clock stretching
      • Provisioned with Endorsement key and Endorsement Key certificate
      • Support of clock suspension for power saving mode
      • Support of Field Upgrade and Dictionary Attack protection
      • Monotonic counter endurance guaranteed for 7 years
      • Support of software and hardware physical presence
    • Hardware features
      • ARM®SecurCore®SC300™ 32-bit RISC core
      • Highly reliable CMOS EEPROM submicron technology
        • 30-year data retention at 25 °C
        • 500 000 typical Erase/Write cycle endurance at 25 °C
      • Temperature range: 0 °C to +70 °C
      • ESD protection up to 4 kV (HBM)
      • 3.3 V supply voltage range
      • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK®packages
    • Security features
      • Active shield and environmental sensors
      • Memory protection unit (MPU)
      • Monitoring of environmental parameters (power and clock)
      • Hardware and software protection against fault injection
      • AIS-31 Class P2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation from 512 to 2048 with a 2-byte step
        • RSA signature and encryption
        • SHA-1 and SHA-256
        • AES-128 in CTR mode
    • Performance and resource features
      • SHA1 computation for 64-byte block: 155 μs1
      • Signature with a 2048-bit key: 150 ms(a)
      • Signature with a 1024-bit key: 30 ms(a)
      • NV storage allocated space: 4 Kbytes (1.2 Kbytes used by EK certificate)
      • Supported 2048-bit key slots:
        • up to 10 key slots (without EK and SRK)
        • 1 key slot in volatile memory for high-frequency loading use case

样片和购买

产品型号
供货状态
封装
包装类型
ECCN (EU)
Country of Origin
Approximate Price (US$)* / Qty
从ST订购
从分销商订购
ST33TPM12I2CR28
批⁠量⁠生⁠产
TSSOP28 9.7 x 4.4 Tape And Reel NEC - 没有经销商,请联系我们的销售办事处
ST33TPM12I2CQFN
批⁠量⁠生⁠产
VFQFPN 32 5x5x1.0 Tape And Reel NEC - 没有经销商,请联系我们的销售办事处

ST33TPM12I2CR28

供货状态

批⁠量⁠生⁠产

单价(US$)

-

Approximate Price (US$)* / Qty

封装

TSSOP28 9.7 x 4.4

包装类型

Tape And Reel

ECCN (EU)

NEC

Country of Origin

-

ST33TPM12I2CQFN

供货状态

批⁠量⁠生⁠产

单价(US$)

-

Approximate Price (US$)* / Qty

封装

VFQFPN 32 5x5x1.0

包装类型

Tape And Reel

ECCN (EU)

NEC

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

相关应用

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DB1555
      Trusted Platform Module with I2C interface based on 32-bit ARM® SecurCore® SC300™ CPU
      3.0
      368 KB
      PDF
      DB1555

      Trusted Platform Module with I2C interface based on 32-bit ARM® SecurCore® SC300™ CPU

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      STSAFE-TPM Standardized solution for trusted devices 1.0
      195 KB
      PDF

      STSAFE-TPM Standardized solution for trusted devices

    • 描述 版本 文档大小 操作
      Make LoRa® easy and secure 1.0
      1.7 MB
      PDF
      Making Sigfox devices easy and secure 1.0
      1.42 MB
      PDF
      STSAFE - Secure Solutions for IoT 1.0
      1.12 MB
      PDF

      Make LoRa® easy and secure

      Making Sigfox devices easy and secure

      STSAFE - Secure Solutions for IoT

Digital Certificates

    • 描述 版本 文档大小 操作
      GlobalSign Trusted Computing CA 1.0
      928 Byte(s)
      ZIP
      ST Intermediate CA 02 1.0
      1.03 KB
      ZIP
      ST TPM Root Certificates 1.0
      1.07 KB
      ZIP
      ST Trusted Platform Module (TPM) endorsement key (EK) certificates 4.0
      185.14 KB
      PDF

      GlobalSign Trusted Computing CA

      ST Intermediate CA 02

      ST TPM Root Certificates

      ST Trusted Platform Module (TPM) endorsement key (EK) certificates

产品型号 供货状态 封装 符合RoHS级别 材料声明**
ST33TPM12I2CQFN
批量生产
VFQFPN 32 5x5x1.0 Ecopack1
ST33TPM12I2CR28
批量生产
TSSOP28 9.7 x 4.4 Ecopack2

ST33TPM12I2CQFN

Package:

VFQFPN 32 5x5x1.0

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFQFPN 32 5x5x1.0

RoHS Compliance Grade

Ecopack1

ST33TPM12I2CR28

Package:

TSSOP28 9.7 x 4.4

Material Declaration**:

Marketing Status

批量生产

Package

TSSOP28 9.7 x 4.4

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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