产品概述

描述

The ST4SIM-110A is an STMicroelectronics SIM and embedded SIM (eSIM or eUICC) product designed for the automotive market. The ST4SIM-110A pre-integrates a cellular connectivity configuration provided by trusted partners. In this way, the product is ready to be deployed to the field.
The device ensures the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).
The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).
The device provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications.
The device integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.
The device is based on the ST33G1M2A, an automotive grade hardware solution, AEC-Q100 qualified grade 2 supporting extreme conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.

所有功能
AEC-Q100 qualified grade 2

Cellular network connectivity configuration provided by trusted partners

Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks

Network access applications supported: SIM / USIM / ISIM / CSIM

Secure element access control (ARF / PKCS#15)

OTA capability over SMS, CAT-TP & HTTPS (including DNS)

Multi-interfaces able to combine eSIM + eSE

Hardware

Product available on ST33G1M2A

ST33 product based on a 32-bit Arm^® SecurCore^® SC300^™ RISC core

Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)

Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)

Serial peripheral interface (SPI), depending on packages

Automotive qualification (AEC-Q100 qualified grade 2)

Operating temperature: -40°C to +105°C

Common Criteria EAL5+

ECOPACK-compliant packages

VFDFPN8 5 × 6 mm, wettable flank (MFF2)

TSSOP20 6.5 × 4.4 mm

安保

Symmetric cryptography DES / 3DES / AES

Asymmetric cryptography RSA (up to 2048 bits)

HTTPS remote management TLS v1.0, v1.1 and v1.2

Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1

Authentication algorithm: MILENAGE, TUAK, CAVE

Software standard compliance

Java Card v3.0.4 Classic

GlobalPlatform card specification v2.2, including GP amendments A, B, C, D and E

ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office)

Power saving features (PSM and eDRX) defined by ETSI release 13
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云

产品型号	状态	描述	类型	供应商
Global Enterprise Connect	批量生产	Arkessa Connectivity and eSIM Subscription Management Services for Enterprises.	云	Arkessa	Global Enterprise Connect 描述: Arkessa Connectivity and eSIM Subscription Management Services for Enterprises.
Truphone SM-DP SM-SR	批量生产	Truphone云订阅管理器数据准备平台（SM-DP）和安全路由平台（SM-SR）。	云	Truphone	Truphone SM-DP SM-SR 描述: Truphone云订阅管理器数据准备平台（SM-DP）和安全路由平台（SM-SR）。

MCU 及 MPU嵌入式软件

产品型号	状态	描述	类型	供应商
STACKFORCE mioty® Protocol Stack for end points	批量生产	mioty Protocol Stack for end nodes, implementing the new ETSI standard TS 103357.	STM32第三方嵌入式软件	STACKFORCE	STACKFORCE mioty® Protocol Stack for end points 描述: mioty Protocol Stack for end nodes, implementing the new ETSI standard TS 103357.

无线连接软件

产品型号	状态	描述	类型	供应商
Global IoT Cellular Connectivity	批量生产	Global IoT Connectivity for ST4SIM - 2G, 3G, 4G and LPWAN (LTE-M , NB-IoT)	接口和连接IC软件	Truphone	Global IoT Cellular Connectivity 描述: Global IoT Connectivity for ST4SIM - 2G, 3G, 4G and LPWAN (LTE-M , NB-IoT)
eSIM/eUICC global roaming profile	批量生产	Arkessa's global roaming profile is embedded in ST4SIM products and enables out-of-the-box global cellular connectivity.	接口和连接IC软件	Arkessa	eSIM/eUICC global roaming profile 描述: Arkessa's global roaming profile is embedded in ST4SIM products and enables out-of-the-box global cellular connectivity.

All resources

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	Resource title		Latest update

产品规格 (1)

	Resource title		Latest update
PDF	DB4088 SIM and eSIM system-on-chip solution for secure automotive applications 2.0		21 Jan 2021	21 Jan 2021 DB4088 SIM and eSIM system-on-chip solution for secure automotive applications 2.0

简报 (3)

	Resource title	Latest update
PDF	Mobile security consumer solutions 1.1	23 Nov 2020	23 Nov 2020 Mobile security consumer solutions 1.1
PDF	ST4SIM product family overview 2.0	12 Jan 2021	12 Jan 2021 ST4SIM product family overview 2.0
PDF	Secure automotive solutions 1.0	17 Sep 2020	17 Sep 2020 Secure automotive solutions 1.0

宣传册 (1)

	Resource title		Latest update
PDF	ST4SIM secure solutions for cellular connectivity 1.0		30 Mar 2020	30 Mar 2020 ST4SIM secure solutions for cellular connectivity 1.0

手册 (2)

	Resource title		Latest update
PDF	ST’s solutions for mobile devices 3.2		23 Nov 2020	23 Nov 2020 ST’s solutions for mobile devices 3.2
PDF	Secure solutions portfolio 1.0		19 Mar 2021	19 Mar 2021 Secure solutions portfolio 1.0

EDA Symbols, Footprints and 3D Models

质量与可靠性

产品型号	Marketing Status	封装	等级规格	符合RoHS级别	材料声明**
ST4SIM-110A	批量生产	DICE	工业	N/A

ST4SIM-110A

Package:

DICE

Material Declaration**:

More Info

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系销售支持。

样片和购买

	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	温度（ºC）		Country of Origin	Budgetary Price (US$)*/Qty
	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	最小值	最大值	Country of Origin	Budgetary Price (US$)*/Qty
	ST4SIM-110A	无法联系到经销商，请联系我们的销售办事处		批量生产	3A991A2	NEC	Not Applicable	DICE	-	-	FRANCE