ST4SIM-110M

批量生产

SIM & eSIM system-on-chip solution for secure M2M industrial applications

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概述
样片和购买
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工具与软件
质量与可靠性
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  • The ST4SIM-110M is an STMicroelectronics best-in-class embedded (u)SIM solution (also called eSIM) designed for all industrial devices.

    This solution integrates advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP and 3GPP2 specifications. In this way, it is possible to integrate easily most MNO / MVNO connectivity configurations.
    Thanks to trusted partners, the ST4SIM-110M already integrates a cellular connectivity configuration ready to be used on the field.
    The ST4SIM-110M provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. This compliance is fundamental for all integrations and deployments of services owned by mobile network operators or third parties.
    The ST4SIM-110M integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.
    The ST4SIM-110M can include an embedded secure element to store credential and/or independent applications directly managed by the MCU (or by another OEM element).
    It is based on the ST33G1M2M device, an industrial grade hardware solution (JEDEC standard), supporting severe conditions.
    The ST4SIM-110M is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.

    主要特性

      • Configurable cellular network connectivity
      • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
      • Network access applications supported: SIM / USIM / ISIM / CSIM
      • Secure element access control (ARF / PKCS#15)
      • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
      • Extensible authentication protocol (EAP)
      • Multi-interfaces able to combine (U)SIM + eSE
    • Hardware
      • Product available on ST33G1M2M
      • ST33 product based on a 32-bit Arm SecurCore SC300 RISC core
      • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
      • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
      • Serial Peripheral Interface (SPI), depending on packages
      • Industrial qualification (JEDEC JESD47)
      • Operating temperature: -40°C to +105°C
      • Common Criteria EAL5+
    • ECOPACK-compliant packages
      • D16 micromodule
      • DFN8 with wettable flanks (MFF2)
      • WLCSP
    • 安保
      • Symmetric cryptography DES / 3DES / AES
      • Asymmetric cryptography RSA (up to 2048 bits)
      • HTTPS remote management TLS v1.0, v1.1 and v1.2
      • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1
      • Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE
    • Software standard compliancy
      • Java Card™ v3.0.4 Classic
      • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
      • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact your local STMicroelectronics sales office)
      • Power saving features (PSM and eDRX) defined by ETSI release 13

特别推荐

All tools & software

    • 产品型号
      状态
      描述
      类型
      供应商

      Global Enterprise Connect

      批量生产

      Arkessa Connectivity and eSIM Subscription Management Services for Enterprises.

      Arkessa

      Truphone SM-DP SM-SR

      批量生产

      Truphone云订阅管理器数据准备平台(SM-DP)和安全路由平台(SM-SR)。

      Truphone
      Global Enterprise Connect

      描述:

      Arkessa Connectivity and eSIM Subscription Management Services for Enterprises.
      Truphone SM-DP SM-SR

      描述:

      Truphone云订阅管理器数据准备平台(SM-DP)和安全路由平台(SM-SR)。
    • 产品型号
      状态
      描述
      类型
      供应商

      eSIM/eUICC global roaming profile

      批量生产

      Arkessa's global roaming profile is embedded in ST4SIM products and enables out-of-the-box global cellular connectivity.

      接口和连接IC软件 Arkessa
      eSIM/eUICC global roaming profile

      描述:

      Arkessa's global roaming profile is embedded in ST4SIM products and enables out-of-the-box global cellular connectivity.
    • 产品型号
      状态
      描述
      类型
      供应商

      SL-CNWLC011101V1

      批量生产

      Complete node to cloud cellular connectivity solution

      Wireless Connectivity Solutions --
      SL-CNWLC011101V1

      描述:

      Complete node to cloud cellular connectivity solution

EDA Symbols, Footprints and 3D Models

STMicroelectronics - ST4SIM-110M

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Symbols

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3D model

3D models

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
ST4SIM-110M
批量生产
DICE 工业 N/A

ST4SIM-110M

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ST4SIM-110M 无法联系到经销商,请联系我们的销售办事处
批量生产
3A991A2 NEC Not Applicable DICE - - FRANCE

ST4SIM-110M

供货状态

批量生产

ECCN (US)

3A991A2

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Not Applicable

封装

DICE

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商